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TLK2201BIRCP

Texas Instruments

TLK2201BIRCP by Texas Instruments

TLK2201BIRCP by Texas Instruments is an Ethernet transceiver with a data rate of 1600 Mbps. It operates at a supply voltage of 2.5V and has a max operating temperature of 85°C, making it suitable for industrial applications requiring high-speed network interfaces.

Median Price

$13.046

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 148 parts In-Stock

1+ parts

$15.000

100+ parts

$11.920

1k+ parts

$11.910

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148

$15.000

$11.920

$11.910

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Rochester

USA . 58,974 parts In-Stock

1+ parts

-

100+ parts

$10.170

1k+ parts

$9.100

10k+ parts

$8.560

58,974

-

$10.170

$9.100

$8.560

DigiKey

USA . 58,974 parts In-Stock

1+ parts

-

100+ parts

$13.380

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-

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58,974

-

$13.380

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Verical

USA . 33,604 parts In-Stock

1+ parts

-

100+ parts

$12.713

1k+ parts

$11.375

10k+ parts

$10.700

33,604

-

$12.713

$11.375

$10.700

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 85 parts In-Stock

1+ parts

$8.813

100+ parts

$9.254

1k+ parts

$8.725

10k+ parts

-

85

$8.813

$9.254

$8.725

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Digiode

USA . 1,321 parts In-Stock

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$9.329

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-

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1,321

$9.329

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Vyrian

USA . 1,962 parts In-Stock

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$9.820

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-

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1,962

$9.820

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Bristol Electronics

USA . 100 parts In-Stock

1+ parts

$15.560

100+ parts

$10.892

1k+ parts

-

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100

$15.560

$10.892

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DigiKey Marketplace

USA . 59,624 parts In-Stock

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59,624

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Chip Stock

USA . 515 parts In-Stock

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515

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ACDS - Activité Composants Distribution Service

France . 100 parts In-Stock

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100

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Dan-Mar Components

USA . 100 parts In-Stock

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100

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Connect4Technologies Inc.

Canada . 20 parts In-Stock

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20

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Component Sense

UK . 9 parts In-Stock

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9

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ComSIT Distribution GmbH

Germany . 9 parts In-Stock

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9

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LWI Electronics Inc

India . 3 parts In-Stock

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3

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Semi Source

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,068 parts In-Stock

1+ parts

$8.838

100+ parts

-

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3,068

$8.838

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Parana Technologies

USA . 499 parts In-Stock

1+ parts

$12.083

100+ parts

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1k+ parts

$12.493

10k+ parts

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499

$12.083

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$12.493

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DigiPath Technology Company

USA . 2,114 parts In-Stock

1+ parts

$13.304

100+ parts

$12.240

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2,114

$13.304

$12.240

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ChromeModa Solutions

Germany . 4,675 parts In-Stock

1+ parts

$13.576

100+ parts

$11.132

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4,675

$13.576

$11.132

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IDEA Electronic Components Group

UK . 1,351 parts In-Stock

1+ parts

$13.576

100+ parts

$12.897

1k+ parts

$12.218

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1,351

$13.576

$12.897

$12.218

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Microchip USA

USA . 2,422 parts In-Stock

1+ parts

$21.590

100+ parts

$21.460

1k+ parts

$21.390

10k+ parts

$21.330

2,422

$21.590

$21.460

$21.390

$21.330

A-Z Elektronik GmbH

Germany . 5,876 parts In-Stock

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5,876

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Lixinc

USA . 1,544 parts In-Stock

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1,544

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Speed Components Ltd (Excess)

Israel . 204 parts In-Stock

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Kepictronics

USA . 141 parts In-Stock

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Overview

Unlock the power of seamless network connectivity with the TLK2201BIRCP by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in their products. The TLK2201BIRCP falls under the category of Network Interfaces, offering a wide range of applications for various networking needs. With its advanced technology and industrial-grade design, this Ethernet transceiver provides high-speed data transfer at 1600 Mbps. Experience the benefits of effortless communication and reliable performance with the TLK2201BIRCP - the perfect solution for your networking requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for use in various networking applications.

Surface Mount: YES

Being surface mountable makes installation and integration of the product easier and more efficient, saving time and effort during assembly.

Power Supplies (V): 2.5

The low power supply requirement of 2.5V helps in reducing power consumption and heat dissipation, leading to energy-efficient operation.

Data Rate: 1600 Mbps

With a high data rate of 1600 Mbps, this product supports high-speed data transmission, making it suitable for demanding network applications that require fast connectivity.

Technical Specifications

Network Interfaces TLK2201BIRCP attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1600 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.111 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2201BIRCP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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