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TLK2201BIRCPG4

Texas Instruments

TLK2201BIRCPG4 by Texas Instruments

TLK2201BIRCPG4 by Texas Instruments is an Ethernet transceiver with 1600 Mbps data rate, operating at -40 to 85 °C. It features a 2.5V supply voltage, quad terminals, and CMOS technology. Ideal for network interfaces in industrial applications due to its compact square package and low power consumption of 0.111 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,834 parts In-Stock

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Digiode

USA . 3,273 parts In-Stock

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Bristol Electronics

USA . 50 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 6 parts In-Stock

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Parana Technologies

USA . 2,352 parts In-Stock

1+ parts

$11.851

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$12.250

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2,352

$11.851

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$12.250

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ChromeModa Solutions

Germany . 3,050 parts In-Stock

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$13.316

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$10.919

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3,050

$13.316

$10.919

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IDEA Electronic Components Group

UK . 1,277 parts In-Stock

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$13.316

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$12.650

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$11.984

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$12.650

$11.984

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AZTECH Wire

Italy . 617 parts In-Stock

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$16.141

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One Stop Electronics

USA . 681 parts In-Stock

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$157.000

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Corphita

USA . 1,948 parts In-Stock

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DigiPath Technology Company

USA . 461 parts In-Stock

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$12.006

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Perfect Parts

USA . 280 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 204 parts In-Stock

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Microchip USA

USA . 178 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 125 parts In-Stock

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Overview

Experience seamless connectivity and reliable performance with the TLK2201BIRCPG4 by Texas Instruments. As a trusted leader in network interfaces, Texas Instruments delivers top-quality products that exceed industry standards. This Ethernet transceiver offers fast data rates of up to 1600 Mbps, making it ideal for a wide range of applications in industrial settings. With its compact design and low power consumption, this product ensures efficient operation and long-term reliability. Trust Texas Instruments for superior networking solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material allows for easier handling and reliable performance.

Surface Mount: YES

Makes it easier to integrate into circuit boards for efficient assembly.

Package Shape: SQUARE

Square shape provides a compact design that can fit well in tight spaces.

Power Supplies (V): 2.5

Operates on a standard voltage, making it compatible with various systems.

No. of Terminals: 64

Provides ample connectivity options for versatile applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Offers multiple packaging options to suit different installation requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance under challenging conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and excellent conductivity for long-lasting connections.

Terminal Position: QUAD

Quad terminal position allows for efficient signal transmission and connectivity.

Maximum Seated Height: 1 mm

Low profile design minimizes space requirements and allows for compact installations.

Width: 10 mm

Narrow width enables the product to be used in space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for reliable soldering results.

Length: 10 mm

Compact length allows for easy integration into circuit designs.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance for efficient operation.

Terminal Form: GULL WING

Gull wing terminals provide easy soldering and secure connections for reliable operation.

Maximum Supply Current: 0.111 mA

Low supply current minimizes power consumption for energy-efficient operation.

Telecom IC Type: ETHERNET TRANSCEIVER

Specifically designed for Ethernet communication, ensuring compatibility with network systems.

Nominal Supply Voltage: 2.5 V

Operates on a stable supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine pitch terminals allow for high-density mounting and efficient signal transmission.

Data Rate: 1600 Mbps

High data rate capability for fast and efficient data transfer in network applications.

Moisture Sensitivity Level (MSL): 3

Moisture-resistant design for reliable operation in humid environments.

Technical Specifications

Network Interfaces TLK2201BIRCPG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1600 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.111 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK2201BIRCPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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