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TLK2201AIRCPRG4

Texas Instruments

TLK2201AIRCPRG4 by Texas Instruments

TLK2201AIRCPRG4 by Texas Instruments is an Ethernet transceiver with 1600 Mbps data rate, operating at -40 to 85 °C. It features a 2.5V supply voltage, 0.111 mA supply current, and a compact square package suitable for network interfaces in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,654 parts In-Stock

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3,654

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Vyrian

USA . 3,047 parts In-Stock

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3,047

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Distributors (Availability)

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Parana Technologies

USA . 1,806 parts In-Stock

1+ parts

$12.020

100+ parts

-

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$12.426

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1,806

$12.020

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$12.426

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DigiPath Technology Company

USA . 1,918 parts In-Stock

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$13.236

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1,918

$13.236

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ChromeModa Solutions

Germany . 3,597 parts In-Stock

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$13.506

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$11.075

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3,597

$13.506

$11.075

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IDEA Electronic Components Group

UK . 804 parts In-Stock

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$13.506

100+ parts

$12.831

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$12.155

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804

$13.506

$12.831

$12.155

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AZTECH Wire

Italy . 641 parts In-Stock

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$14.500

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641

$14.500

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One Stop Electronics

USA . 319 parts In-Stock

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$559.000

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319

$559.000

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QUARKTWIN TECHNOLOGY LTD

USA . 20,887 parts In-Stock

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Corphita

USA . 3,248 parts In-Stock

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Microchip USA

USA . 485 parts In-Stock

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485

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Kepictronics

USA . 220 parts In-Stock

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220

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Overview

Experience seamless and lightning-fast network connections with the TLK2201AIRCPRG4 by Texas Instruments. Known for their top-notch quality, Texas Instruments has crafted this Ethernet transceiver to deliver unparalleled performance in a compact and durable package. Ideal for industrial applications, this innovative product offers customers unmatched reliability and efficiency, ensuring smooth communication across various devices. Stay connected with confidence using the TLK2201AIRCPRG4 and elevate your networking experience to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy as the package body material makes the product lightweight and durable, ideal for long-term use in various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, saving time and effort during assembly.

Power Supplies (V): 2.5

The power supply voltage of 2.5V is efficient and suitable for the operation of this product, ensuring stable performance and energy efficiency.

No. of Terminals: 64

With 64 terminals, this product provides ample connectivity options, making it versatile and compatible with various systems and configurations.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the product can withstand elevated temperatures without compromising performance, making it reliable in demanding conditions.

Technology: CMOS

The use of CMOS technology enhances the product's efficiency and performance, making it a reliable choice for networking applications.

Technical Specifications

Network Interfaces TLK2201AIRCPRG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1600 Mbps

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.111 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TLK2201AIRCPRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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