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TLK2201ARCPRG4

Texas Instruments

TLK2201ARCPRG4 by Texas Instruments

TLK2201ARCPRG4 by Texas Instruments is an Ethernet transceiver with 1600 Mbps data rate, operating at 2.5V supply voltage and 0.111 mA current. It features a quad terminal position in a square package style suitable for network interfaces applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,271 parts In-Stock

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Digiode

USA . 1,004 parts In-Stock

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1,004

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Distributors (Availability)

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AZTECH Wire

Italy . 719 parts In-Stock

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$12.883

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719

$12.883

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Parana Technologies

USA . 971 parts In-Stock

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$15.927

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$1,479.104

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$14.335

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971

$15.927

$1,479.104

$14.335

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DigiPath Technology Company

USA . 112 parts In-Stock

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$17.538

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$16.135

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112

$17.538

$16.135

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ChromeModa Solutions

Germany . 5,403 parts In-Stock

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$17.896

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$14.675

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5,403

$17.896

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IDEA Electronic Components Group

UK . 1,729 parts In-Stock

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$17.896

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$17.001

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$16.106

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1,729

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$16.106

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Ampacity Inc.

Singapore . 684 parts In-Stock

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$134.000

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Semicontronic

India . 829 parts In-Stock

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$364.000

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$354.900

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$353.080

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829

$364.000

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One Stop Electronics

USA . 1,311 parts In-Stock

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$950.000

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Microchip USA

USA . 5,792 parts In-Stock

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Corphita

USA . 2,387 parts In-Stock

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Corohmni

South Africa . 140 parts In-Stock

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Overview

Experience seamless connectivity and superior performance with the TLK2201ARCPRG4 by Texas Instruments. As a leader in network interfaces, Texas Instruments delivers top-quality products that are designed to meet your networking needs. This Ethernet transceiver is perfect for a wide range of applications, offering reliability and efficiency. With a commercial temperature grade and low power consumption, this product provides value and convenience for customers looking to enhance their network systems. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making it ideal for a portable or long-lasting network interface.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and making the product suitable for compact designs.

Power Supplies (V): 2.5

Operates on a low power supply of 2.5V, making it energy-efficient and suitable for applications where power consumption is a concern.

No. of Terminals: 64

Having 64 terminals provides flexibility in connectivity options and allows for multiple connections to other devices or components.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this network interface can withstand heat and operate reliably in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the network interface efficient and reliable for data transmission.

Data Rate: 1600 Mbps

With a high data rate of 1600 Mbps, this network interface can handle high-speed data transmission, making it suitable for demanding network applications.

Technical Specifications

Network Interfaces TLK2201ARCPRG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1600 Mbps

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.111 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TLK2201ARCPRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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