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TLK2201BRCPRG4

Texas Instruments

TLK2201BRCPRG4 by Texas Instruments

TLK2201BRCPRG4 by Texas Instruments is an Ethernet transceiver with a data rate of 1600 Mbps. It operates at 2.5V and has a terminal pitch of 0.5mm, suitable for network interfaces in commercial applications. The package style includes flatpack, heat sink/slug, and very thin profile features.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,040 parts In-Stock

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Digiode

USA . 557 parts In-Stock

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557

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Distributors (Availability)

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AZTECH Wire

Italy . 726 parts In-Stock

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$8.563

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726

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Parana Technologies

USA . 1,945 parts In-Stock

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$15.934

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$16.288

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DigiPath Technology Company

USA . 1,288 parts In-Stock

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$17.545

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$16.141

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$17.545

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ChromeModa Solutions

Germany . 6,476 parts In-Stock

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$17.903

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$14.680

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IDEA Electronic Components Group

UK . 2,096 parts In-Stock

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$17.903

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$17.008

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$16.113

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One Stop Electronics

USA . 1,558 parts In-Stock

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$626.000

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Microchip USA

USA . 2,578 parts In-Stock

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Corphita

USA . 556 parts In-Stock

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Kepictronics

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Overview

Transform your network communications with the TLK2201BRCPRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers high-quality products that are reliable and efficient. The TLK2201BRCPRG4 is a versatile Ethernet transceiver that offers fast data rates of up to 1600 Mbps, making it ideal for a wide range of applications. With its compact design and low power consumption, this network interface provides exceptional value and performance for all your networking needs. Experience seamless connectivity and enhanced productivity with the TLK2201BRCPRG4.

Feature Benefit Bullets

Package Body Material: Plastic/Epoxy

The use of plastic/epoxy as the package body material makes this product lightweight and durable.

Surface Mount: Yes

Being surface mountable, this product allows for easy installation on circuit boards, saving space and reducing assembly time.

Power Supplies (V): 2.5

The 2.5V power supply ensures compatibility with a wide range of systems and devices.

No. of Terminals: 64

With 64 terminals, this product offers ample connectivity options for versatile networking applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in challenging environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting connectivity.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high-speed data processing capabilities.

Data Rate: 1600 Mbps

With a high data rate of 1600 Mbps, this product enables fast and efficient data transmission for network applications.

Technical Specifications

Network Interfaces TLK2201BRCPRG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1600 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.111 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

TLK2201BRCPRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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