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TLC542IDWR

Texas Instruments

TLC542IDWR by Texas Instruments

TLC542IDWR by Texas Instruments is an 8-bit ADC with 11 analog in channels, 0.1953% max linearity error, and 0.04 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion within a temperature range of -40 to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,849 parts In-Stock

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3,849

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Digiode

USA . 463 parts In-Stock

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463

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Chip Stock

USA . 365 parts In-Stock

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365

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Bristol Electronics

USA . 74 parts In-Stock

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Atlantic Semiconductor

USA . 74 parts In-Stock

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74

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Distributors (Availability)

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Andel Nordic

Denmark . 119 parts In-Stock

1+ parts

$7.093

100+ parts

-

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$6.809

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$6.809

119

$7.093

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$6.809

$6.809

AZTECH Wire

Italy . 789 parts In-Stock

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$9.012

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789

$9.012

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Parana Technologies

USA . 480 parts In-Stock

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$20.313

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$20.325

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480

$20.313

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$20.325

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ChromeModa Solutions

Germany . 2,794 parts In-Stock

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$22.824

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$18.716

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$22.824

$18.716

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IDEA Electronic Components Group

UK . 2,221 parts In-Stock

1+ parts

$22.824

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$21.683

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$20.542

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2,221

$22.824

$21.683

$20.542

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One Stop Electronics

USA . 319 parts In-Stock

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$27.000

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319

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Perfect Parts

USA . 21,105 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,962 parts In-Stock

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Corphita

USA . 4,555 parts In-Stock

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DigiPath Technology Company

USA . 1,385 parts In-Stock

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$20.578

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$20.578

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Microchip USA

USA . 460 parts In-Stock

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460

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Overview

Unlock the power of precision with the TLC542IDWR by Texas Instruments, a top-tier manufacturer known for quality and innovation. As a leading Analog-to-Digital Converter in its category, this product offers 11 analog input channels and 8 bits of resolution for accurate conversions. Ideal for industrial applications, this converter boasts a low linearity error of 0.1953% and a fast conversion time of 20 microseconds, ensuring reliable performance under various conditions. Trust Texas Instruments to deliver value, efficiency, and unmatched quality with the TLC542IDWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product more reliable and affordable.

No. of Analog In Channels: 11

Having 11 analog input channels allows for versatile and multi-channel signal processing capabilities.

Surface Mount: YES

Surface mount packaging makes the product easy to assemble and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to design into circuits.

No. of Bits: 8

8-bit resolution provides a good balance between accuracy and cost for many applications.

Maximum Linearity Error (EL): 0.1953%

Low linearity error ensures accurate conversion of analog signals to digital data.

No. of Terminals: 20

Having 20 terminals allows for easy connection and integration into the system.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact designs.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range ensures the product can be used in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit board layout and routing.

Maximum Conversion Time: 20 us

Fast conversion time allows for quick processing of analog signals.

Maximum Seated Height: 2.65 mm

Low seated height saves space and makes the product suitable for slim designs.

Width: 7.5 mm

Compact width allows for efficient use of PCB space.

Maximum Time At Peak Reflow Temperature (s): 30

30-second peak reflow time ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable solder joints during assembly.

Length: 12.8 mm

Length of 12.8 mm allows for easy integration into circuit designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environments.

Maximum Analog Input Voltage: 5.5 V

High maximum analog input voltage allows for compatibility with a wide range of input signals.

Sample Rate: 0.04 MHz

High sample rate of 0.04 MHz allows for fast conversion of analog signals to digital data.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and reliable connections.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC provides accurate and efficient conversion of analog signals.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is common and easily accessible for powering the product.

Output Bit Code: BINARY

Binary output bit code is widely used and compatible with most digital systems.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch allows for easy integration and connection with other components on the PCB.

Minimum Analog Input Voltage: 0 V

Having a minimum analog input voltage of 0V allows for accurate measurement of zero-level signals.

Output Format: SERIAL

Serial output format is efficient for transmitting digital data to other components in the system.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold functionality allows for accurate sampling of analog signals for conversion.

Technical Specifications

Analog-to-Digital Converters TLC542IDWR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC542IDWR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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