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TLC540IFNG3

Texas Instruments

TLC540IFNG3 by Texas Instruments

TLC540IFNG3 by Texas Instruments is an 8-bit ADC with 11 analog input channels, 0.1953% linearity error, and 0.07518 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact chip carrier package. Operating temperature range from -40 to 85°C makes it suitable for various environments.

Median Price

$3.075

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 136 parts In-Stock

1+ parts

-

100+ parts

$2.750

1k+ parts

$2.460

10k+ parts

$2.310

136

-

$2.750

$2.460

$2.310

DigiKey

USA . 136 parts In-Stock

1+ parts

-

100+ parts

$3.180

1k+ parts

-

10k+ parts

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136

-

$3.180

-

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Verical

USA . 136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.075

10k+ parts

$2.888

136

-

-

$3.075

$2.888

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,886 parts In-Stock

1+ parts

$2.907

100+ parts

-

1k+ parts

-

10k+ parts

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1,886

$2.907

-

-

-

TEDSS.com

USA . 56 parts In-Stock

1+ parts

$5.000

100+ parts

$3.990

1k+ parts

-

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56

$5.000

$3.990

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-

Vyrian

USA . 8,844 parts In-Stock

1+ parts

-

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8,844

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DigiKey Marketplace

USA . 136 parts In-Stock

1+ parts

-

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-

1k+ parts

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136

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,234 parts In-Stock

1+ parts

$2.754

100+ parts

-

1k+ parts

-

10k+ parts

-

4,234

$2.754

-

-

-

Component Stockers USA

USA . 201 parts In-Stock

1+ parts

$3.140

100+ parts

$2.950

1k+ parts

-

10k+ parts

-

201

$3.140

$2.950

-

-

Parana Technologies

USA . 866 parts In-Stock

1+ parts

$23.255

100+ parts

-

1k+ parts

$23.884

10k+ parts

-

866

$23.255

-

$23.884

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DigiPath Technology Company

USA . 923 parts In-Stock

1+ parts

$25.606

100+ parts

$23.558

1k+ parts

-

10k+ parts

-

923

$25.606

$23.558

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-

ChromeModa Solutions

Germany . 2,566 parts In-Stock

1+ parts

$26.129

100+ parts

$21.426

1k+ parts

-

10k+ parts

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2,566

$26.129

$21.426

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IDEA Electronic Components Group

UK . 2,070 parts In-Stock

1+ parts

$26.129

100+ parts

$24.823

1k+ parts

$23.516

10k+ parts

-

2,070

$26.129

$24.823

$23.516

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Microchip USA

USA . 457 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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457

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Overview

Unlock the power of precision with the Texas Instruments TLC540IFNG3 Analog-to-Digital Converter. Crafted with expertise by Texas Instruments, this top-quality product offers unmatched accuracy and reliability for a wide range of applications. Whether you're in the industrial sector or working on cutting-edge technology, this ADC delivers superior performance that exceeds expectations. Experience seamless integration, fast conversion times, and exceptional value with the TLC540IFNG3. Elevate your projects with the best in class from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection, making the product suitable for a variety of applications.

No. of Analog In Channels: 11

Allows for multiple analog inputs to be converted, increasing versatility and functionality.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort.

No. of Bits: 8

High resolution for accurate analog-to-digital conversion.

Maximum Linearity Error (EL): 0.1953 %

Ensures accuracy in converting analog signals to digital data.

No. of Terminals: 20

Provides ample connection points for seamless integration into a circuit.

Package Style (Meter): CHIP CARRIER

Compact and space-saving design for efficient use of PCB real estate.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Allows for operation in cold environments without performance issues.

Terminal Finish: MATTE TIN

Enhances electrical conductivity and solderability for reliable connections.

Maximum Conversion Time: 9 us

Fast conversion time for real-time data processing.

Technology: CMOS

Low power consumption and high noise immunity for efficient operation.

Nominal Supply Voltage: 5 V

Standard voltage supply for easy integration into existing systems.

Technical Specifications

Analog-to-Digital Converters TLC540IFNG3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

75.18 kHz

Hold Mode:

Sample

Maximum Conversion Time:

9 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.353 in (8.965 mm)

Length:

0.353 in (8.965 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-J20

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

TLC540IFNG3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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