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TISP8200MDR

Texas Instruments

TISP8200MDR by Texas Instruments

TISP8200MDR by Texas Instruments is a surge protection circuit in a small outline package with 8 terminals. It features gull wing terminal form, 1.27mm pitch, and plastic/epoxy body material. Ideal for telecom applications requiring surface mount protection ICs with compact dimensions.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Legend Electronics Inc.

USA . 12,500 parts In-Stock

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12,500

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 10,000 parts In-Stock

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10,000

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Vyrian

USA . 4,093 parts In-Stock

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4,093

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Digiode

USA . 813 parts In-Stock

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813

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Cyclops Electronics Ltd

UK . 89 parts In-Stock

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89

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Parana Technologies

USA . 2,223 parts In-Stock

1+ parts

$6.448

100+ parts

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$7.191

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2,223

$6.448

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$7.191

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ChromeModa Solutions

Germany . 2,826 parts In-Stock

1+ parts

$7.245

100+ parts

$5.941

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2,826

$7.245

$5.941

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IDEA Electronic Components Group

UK . 659 parts In-Stock

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$7.245

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$6.520

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659

$7.245

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$6.520

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AZTECH Wire

Italy . 632 parts In-Stock

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$7.525

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632

$7.525

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One Stop Electronics

USA . 1,000 parts In-Stock

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$15.000

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1,000

$15.000

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A-Z Elektronik GmbH

Germany . 5,781 parts In-Stock

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5,781

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Assy Fe

Spain . 3,839 parts In-Stock

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Corphita

USA . 3,532 parts In-Stock

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3,532

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 1,217 parts In-Stock

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$6.532

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$6.532

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Kepictronics

USA . 830 parts In-Stock

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830

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Perfect Parts

USA . 6 parts In-Stock

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6

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Overview

Upgrade your telecom system with the TISP8200MDR surge protection circuit by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers reliable solutions for telecom applications. This compact and efficient device offers superior protection for your equipment, ensuring smooth operation and longevity. Trust in Texas Instruments to provide you with the best-in-class telecom protection ICs for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides good insulation and protection for the IC, ensuring its durability and longevity.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various circuit designs, maximizing space utilization and efficiency.

No. of Terminals: 8

Having 8 terminals provides more connectivity options and flexibility in circuit connections, allowing for versatile applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs and reducing overall system size.

Terminal Position: DUAL

Dual terminal position ensures better stability and reliability in connections, reducing the risk of signal losses or circuit failures.

Maximum Seated Height: 1.75 mm

With a low maximum seated height, this IC can be easily accommodated in slim and compact electronic devices.

Width: 3.9 mm

The narrow width of the IC enables better space efficiency on the PCB, allowing for more components to be placed within a limited area.

Length: 4.9 mm

The short length of the IC contributes to a compact overall design, making it suitable for applications where space is limited.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability to the connections, ensuring a reliable and secure attachment to the PCB.

Telecom IC Type: SURGE PROTECTION CIRCUIT

As a surge protection circuit, this IC offers vital protection for telecom systems against sudden voltage spikes, safeguarding the equipment from damage.

Terminal Pitch: 1.27 mm

The narrow terminal pitch allows for high-density mounting, making it suitable for applications where space-saving and efficiency are crucial.

Technical Specifications

Telecom - Protection ICs TISP8200MDR attributes and parameters. Explore more Telecom - Protection ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TISP8200MDR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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