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TIFPLA840CFN

Texas Instruments

TIFPLA840CFN by Texas Instruments

TIFPLA840CFN by Texas Instruments is a TTL technology-based PLA-TYPE programmable logic device with 14 dedicated inputs and 6 outputs. It features a propagation delay of 25 ns, operates at a max supply voltage of 5.25 V, and has a package style of CHIP CARRIER. Ideal for applications requiring combinatorial output functions in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,457 parts In-Stock

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4,457

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Vyrian

USA . 4,100 parts In-Stock

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4,100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$7.022

100+ parts

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884

$7.022

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One Stop Electronics

USA . 399 parts In-Stock

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$28.000

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399

$28.000

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Parana Technologies

USA . 2,188 parts In-Stock

1+ parts

$139.926

100+ parts

$12,994.233

1k+ parts

$125.933

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2,188

$139.926

$12,994.233

$125.933

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DigiPath Technology Company

USA . 1,881 parts In-Stock

1+ parts

$154.076

100+ parts

$141.750

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1,881

$154.076

$141.750

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ChromeModa Solutions

Germany . 5,176 parts In-Stock

1+ parts

$157.220

100+ parts

$128.920

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5,176

$157.220

$128.920

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IDEA Electronic Components Group

UK . 1,906 parts In-Stock

1+ parts

$157.220

100+ parts

$149.359

1k+ parts

$141.498

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1,906

$157.220

$149.359

$141.498

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Corphita

USA . 1,456 parts In-Stock

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1,456

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Overview

Unlock endless possibilities with the TIFPLA840CFN by Texas Instruments, a top-tier Programmable Logic Device that delivers unparalleled performance and reliability. Crafted with precision using cutting-edge technology, this chip offers lightning-fast propagation delay and a wide range of applications in various industries. With its innovative architecture and advanced features, this PLD ensures seamless operation and optimal efficiency. Elevate your projects to new heights with the superior quality and exceptional value of the TIFPLA840CFN, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the PLD, ensuring it can withstand various environmental conditions.

Propagation Delay: 25 ns

With a fast propagation delay of 25 ns, this PLD can process input signals quickly, making it suitable for applications requiring rapid data processing.

Surface Mount: YES

Being surface mountable makes installation easier and allows for compact designs, ideal for space-constrained applications.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this PLD can handle higher power requirements and voltages, making it versatile for a range of applications.

Technology Used: TTL

Utilizing TTL technology ensures reliable and high-speed operation, making this PLD suitable for applications requiring fast and accurate logic processing.

No. of Inputs: 14

Having 14 inputs provides flexibility in designing complex logic circuits, making this PLD suitable for tasks that require multiple input signals.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy placement in circuit designs, enhancing overall integration and layout.

Form Of Terminal: J BEND

J bend terminals provide secure connections and ease of soldering, ensuring reliable electrical connections in the circuit.

Architecture: PLA-TYPE

PLA-type architecture allows for programmability and customization of logic functions, making this PLD versatile for various applications that require specific logic configurations.

Nominal Supply Voltage (V): 5

Matching the nominal supply voltage of 5V with typical operating conditions simplifies design considerations and ensures compatibility with standard power sources.

Power Supplies (V): 5

Having dedicated power supplies at 5V ensures stable and consistent power delivery to the PLD, enabling reliable performance under varying load conditions.

No. of Terminals: 28

Having 28 terminals provides connectivity options and allows for interfacing with external components, increasing the versatility of this PLD in different circuit designs.

Programmable IC Type: OT PLD

Being a programmable IC type allows for customization and flexibility in defining logic functions, making this PLD adaptable to different application requirements.

Package Style (Meter): CHIP CARRIER

A chip carrier package style offers compact size and low profile, ideal for applications where space-saving is essential while maintaining high performance.

Output Function: COMBINATORIAL

Combinatorial output function allows for logic operations without feedback, simplifying circuit design and enabling efficient processing of input signals.

No. of Product Terms: 32

Having 32 product terms provides flexibility in configuring logic functions, allowing for complex signal processing and manipulation in the PLD.

Minimum Supply Voltage: 4.75 V

A low minimum supply voltage of 4.75V ensures compatibility with a wide range of power sources and minimizes power consumption, making this PLD energy-efficient.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this PLD can withstand elevated temperatures and operate reliably in demanding thermal conditions.

Pitch Of Terminal: 1.27 mm

Having a standard pitch of 1.27mm facilitates easy connection and alignment with other components on the circuit board, simplifying assembly processes.

Organization: 14 DEDICATED INPUTS, 0 I/O

The organization with 14 dedicated inputs and 0 I/O (input/output) terminals allows for efficient signal processing and logic operations without the need for external output connections.

No. of Dedicated Inputs: 14

With 14 dedicated inputs, this PLD can handle a variety of input signals simultaneously, enabling complex logic operations and processing capabilities.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance in cold environments, making this PLD suitable for a wide range of operating conditions.

Position Of Terminal: QUAD

Having terminals positioned in a quad layout allows for easy identification and organization, simplifying circuit board layout and connection design.

Maximum Seated Height: 4.57 mm

With a low maximum seated height of 4.57mm, this PLD can be integrated into compact systems and designs, saving space and enhancing overall system efficiency.

Width: 11.5062 mm

The width of 11.5062mm provides a compact form factor for the PLD, making it suitable for applications with limited board space and size constraints.

No. of Outputs: 6

Having 6 outputs allows for multiple signal outputs and logic operations, enabling the PLD to perform diverse functions and tasks in a circuit design.

Length: 11.5062 mm

The length of 11.5062mm offers a balanced form factor for the PLD, ensuring compatibility with standard board layouts and designs while providing adequate space for connectivity.

Grading Of Temperature: COMMERCIAL

Being rated for commercial temperature grading ensures reliable performance in typical operating conditions, making this PLD suitable for a wide range of commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA840CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Combinatorial

No. of Inputs:

14

No. of Product Terms:

32

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Width:

11.5062 mm

Length:

11.5062 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

TIFPLA840CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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