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XC2C256-7CPG132I

Xilinx

XC2C256-7CPG132I by Xilinx

The Xilinx XC2C256-7CPG132I is a 256 macrocell FLASH PLD with 106 I/O lines, operating at max frequency of 108 MHz. It features a propagation delay of 7.5 ns and can be in-system programmable. Ideal for industrial applications requiring high-speed processing and versatile I/O capabilities in a compact GRID ARRAY package.

Median Price

$80.635

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Mouser Electronics

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Digiode

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Vigor

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Semicontronic

India . 395 parts In-Stock

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One Stop Electronics

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Advanced Electronics

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Bastille Electronics

Australia . 10 parts In-Stock

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Corohmni

South Africa . 151 parts In-Stock

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Modulus Dynamics

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Texas Native Microelectronics

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Microchip USA

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Qasali Group International

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Overview

Unlock the power of Xilinx's XC2C256-7CPG132I Programmable Logic Device, designed to deliver unparalleled performance and versatility. With a superior architecture and cutting-edge technology, this FLASH PLD offers customers a seamless in-system programmable solution for a wide range of applications. From industrial automation to telecommunications, this high-quality product boasts 256 macro cells and 106 I/O lines, providing unmatched flexibility and efficiency. Trust Xilinx to deliver the innovation you need to stay ahead in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Propagation Delay: 7.5 ns

Fast propagation delay ensures quick processing of signals, making the PLD suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.9 V

Low maximum supply voltage helps in reducing power consumption and heat generation, making the PLD energy-efficient.

No. of Macro Cells: 256

Large number of macro cells provide flexibility in designing complex logic functions, making the PLD versatile for various applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the overall efficiency and reliability of the PLD.

No. of Inputs: 106

Abundance of inputs allows for connectivity with multiple external devices, enhancing the PLD's ability to handle diverse input signals.

Package Shape: SQUARE

Square package shape provides uniformity and ease of handling during assembly and installation processes.

Form Of Terminal: BALL

Ball terminals ensure secure connections and efficient heat dissipation, contributing to the overall performance and reliability of the PLD.

Architecture: PLA-TYPE

PLA-type architecture enables programmability and customization of logic functions, allowing users to tailor the PLD to specific requirements.

Nominal Supply Voltage (V): 1.8

Stable nominal supply voltage ensures consistent performance and signal integrity, making the PLD suitable for critical applications.

Power Supplies (V): 1.5/3.3,1.8

Support for multiple power supply voltages offers flexibility in voltage compatibility, accommodating different system requirements.

No. of Terminals: 132

Sufficient number of terminals facilitate easy connectivity with external devices, enhancing the versatility and functionality of the PLD.

Programmable IC Type: FLASH PLD

Flash programmability allows for quick and easy reconfiguration of logic functions, providing convenience and adaptability for design changes.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch design enables high-density mounting and interconnection of the PLD, optimizing space utilization on PCBs.

In-System Programmable: YES

In-system programmability allows for on-the-fly reprogramming of logic functions without the need for physical removal, enhancing flexibility and ease of use.

Output Function: MACROCELL

Macrocell output function provides configurable logic elements for implementing complex functions, enhancing the PLD's capacity for handling various logic operations.

Minimum Supply Voltage: 1.7 V

Low minimum supply voltage ensures compatibility with a wide range of power sources, increasing the PLD's adaptability in different operating environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance enables reliable performance in challenging thermal conditions, ensuring the PLD's functionality in diverse environments.

Pitch Of Terminal: 0.5 mm

Fine pitch terminal spacing allows for high-density mounting and interconnection, optimizing PCB layout and reducing signal interference.

Organization: 0 DEDICATED INPUTS, 106 I/O

Dedicated inputs with a high number of I/O lines support efficient signal routing and processing, enhancing the PLD's capability for handling complex logic functions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance ensures reliable performance in cold environments, making the PLD suitable for a wide range of applications.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin silver copper terminal finishing provides strong solder joints and corrosion resistance, ensuring reliable interconnection and long-term durability.

Position Of Terminal: BOTTOM

Bottom terminal positioning facilitates easy PCB assembly and connection, simplifying the installation process and improving operational efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, ensuring safe storage and handling practices to prevent damage during assembly and operation.

Maximum Seated Height: 1.1 mm

Low maximum seated height enables compact design and minimizes PCB clearance requirements, optimizing space utilization in constrained environments.

Width: 8 mm

Compact width dimension saves board space and allows for dense packing of components, enhancing the overall system integration of the PLD.

Maximum Clock Frequency: 108 MHz

High maximum clock frequency supports rapid signal processing and efficient operation, making the PLD suitable for high-speed applications.

No. of Outputs: 106

Abundance of outputs provides flexibility in routing logic signals to external devices, enhancing the PLD's capability for diverse output configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for adequate time at peak reflow temperature during soldering processes, ensuring proper bonding and reliable connections for long-term operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports robust soldering processes, ensuring strong and durable connections for the PLD's reliable performance.

Length: 8 mm

Compact length dimension saves board space and allows for efficient component placement, contributing to the overall system integration and reliability of the PLD.

JTAG Boundary Scan Test: YES

JTAG boundary scan test capability allows for easy testing and debugging of the PLD's functionality, ensuring quick identification and resolution of potential issues.

No. of I/O Lines: 106

Abundance of I/O lines provides flexibility in interfacing with external devices, enhancing the PLD's connectivity and functional capabilities for various applications.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature grading indicates robust performance and reliability in harsh operating conditions, making the PLD suitable for industrial applications.

Technical Specifications

Programmable Logic Devices (PLD) XC2C256-7CPG132I attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Xilinx

IC Features

Programmable IC Type:

In-System Programmable:

Yes

Organization:

0 Dedicated Inputs, 106 I/O

No. of Outputs:

106

Output Function:

Macrocell

No. of Inputs:

106

No. of Macro Cells:

256

No. of Dedicated Inputs:

0

No. of I/O Lines:

106

Maximum Clock Frequency:

108 MHz

Propagation Delay:

7.5 ns

Technology:

CMOS

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Real Digital Design Technology

Power Characteristics

Nominal Supply Voltage:

1.8

Minimum Supply Voltage:

1.7 V

Maximum Supply Voltage:

1.9 V

Power Supplies (V):

1.5/3.3,1.8 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Temprature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Package Equivalence Code:

BGA132,14X14,20

Width:

8 mm

Length:

8 mm

Maximum Seated Height:

1.1 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Form:

No. of Terminals:

132

Terminal Pitch:

.5 mm

Terminal Finish:

Tin Silver Copper

Standards

JESD-30 Code:

S-PBGA-B132

JESD-609 Code:

e1

JTAG Boundary Scan Test:

Yes

Qualified:

No

Trade Compliance

XC2C256-7CPG132I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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