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TIFPLA839CNT

Texas Instruments

TIFPLA839CNT by Texas Instruments

TIFPLA839CNT by Texas Instruments is a TTL technology-based Programmable Logic Device with 20ns propagation delay and 5.25V max supply voltage. It features 14 dedicated inputs, 6 outputs, and 32 product terms, making it ideal for combinatorial output functions in commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,754 parts In-Stock

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Digiode

USA . 2,319 parts In-Stock

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2,319

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A2Z Electronics, Inc.

USA . 149 parts In-Stock

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149

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Bristol Electronics

USA . 149 parts In-Stock

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149

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Mentor Electronics Marketing, LLC

USA . 65 parts In-Stock

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65

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Elcom Components

USA . 9 parts In-Stock

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AZTECH Wire

Italy . 578 parts In-Stock

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$7.989

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578

$7.989

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Parana Technologies

USA . 1,341 parts In-Stock

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$25.664

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$26.267

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$25.664

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$26.267

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DigiPath Technology Company

USA . 325 parts In-Stock

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$28.259

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$25.999

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$28.259

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ChromeModa Solutions

Germany . 4,536 parts In-Stock

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$28.836

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$23.646

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$28.836

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IDEA Electronic Components Group

UK . 865 parts In-Stock

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$28.836

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$27.394

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$25.952

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865

$28.836

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One Stop Electronics

USA . 264 parts In-Stock

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$31.000

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264

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Authorized Procurement Solutions

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Corphita

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Overview

Unlock endless possibilities with the TIFPLA839CNT by Texas Instruments. Crafted with precision and expertise, this Programmable Logic Device is designed to revolutionize your projects. Whether you're a hobbyist or a professional, this PLA-TYPE device offers unparalleled speed and reliability with its 20 ns propagation delay and 32 product terms. With 14 dedicated inputs and 6 outputs, this OT PLD will elevate your creations to new heights. Trust in Texas Instruments for quality and innovation - unleash your creativity with the TIFPLA839CNT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the PLD, making it a reliable choice for long-term use.

Propagation Delay: 20 ns

Fast propagation delay of 20 ns ensures quick response times, making this PLD suitable for high-speed applications where timing is critical.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage of 5.25 V provides flexibility in power supply options and compatibility with various systems.

Technology Used: TTL

TTL technology offers high-speed performance and low power consumption, making this PLD efficient and suitable for a wide range of applications.

No. of Inputs: 14

Having 14 inputs allows for a greater degree of input flexibility and expands the potential functionality of the PLD.

Package Shape: RECTANGULAR

Rectangular package shape offers easy integration and installation in different types of electronic systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering, ensuring reliability in electrical connections.

Architecture: PLA-TYPE

PLA-type architecture offers flexible and customizable logic functions, allowing for versatile implementation in various digital systems.

Nominal Supply Voltage (V): 5

Having a nominal supply voltage of 5 V makes this PLD compatible with standard power sources and simplifies integration into existing systems.

No. of Outputs: 6

With 6 outputs, this PLD can handle multiple output signals, increasing its versatility in controlling various components or devices.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA839CNT attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Combinatorial

No. of Inputs:

14

No. of Product Terms:

32

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Propagation Delay:

20 ns

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T24

Qualified:

No

Trade Compliance

TIFPLA839CNT Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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