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TIFPLA840CNT3

Texas Instruments

TIFPLA840CNT3 by Texas Instruments

TIFPLA840CNT3 by Texas Instruments is a TTL technology-based Programmable Logic Device with 14 inputs and 6 outputs. It operates at a nominal voltage of 5V, suitable for commercial applications requiring a PLA-type architecture in a rectangular package with through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,070 parts In-Stock

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3,070

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Digiode

USA . 944 parts In-Stock

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944

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Distributors (Availability)

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AZTECH Wire

Italy . 807 parts In-Stock

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$15.934

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807

$15.934

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One Stop Electronics

USA . 586 parts In-Stock

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$33.000

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586

$33.000

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Parana Technologies

USA . 266 parts In-Stock

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$84.328

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266

$84.328

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DigiPath Technology Company

USA . 2,097 parts In-Stock

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$92.856

100+ parts

$85.428

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2,097

$92.856

$85.428

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ChromeModa Solutions

Germany . 4,099 parts In-Stock

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$94.751

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$77.696

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4,099

$94.751

$77.696

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IDEA Electronic Components Group

UK . 2,290 parts In-Stock

1+ parts

$94.751

100+ parts

$90.013

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$85.276

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2,290

$94.751

$90.013

$85.276

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Corphita

USA . 1,141 parts In-Stock

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1,141

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Overview

Unleash the power of cutting-edge technology with the TIFPLA840CNT3 by Texas Instruments. Crafted with precision and expertise, this Programmable Logic Device offers unparalleled quality and reliability. Ideal for a variety of applications in the field of electronics, this PLD is designed to deliver exceptional performance and versatility. Experience seamless integration and enhanced functionality with this innovative product. Upgrade your projects and systems with the TIFPLA840CNT3 and discover the countless benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the programmable logic device, ensuring a longer lifespan and reliable performance.

Technology Used: TTL

TTL technology offers fast operation and low power consumption, making the programmable logic device efficient and suitable for various applications.

No. of Inputs: 14

With 14 inputs, this programmable logic device allows for a wide range of input signals to be processed, offering flexibility and versatility in design.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration and installation of the programmable logic device in different electronic systems, making it user-friendly.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V, this programmable logic device is compatible with standard power sources, simplifying the overall system design.

No. of Outputs: 6

With 6 outputs, this programmable logic device can drive multiple components or signals, enhancing the connectivity and functionality of the electronic system it is used in.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA840CNT3 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

6

No. of Inputs:

14

No. of Product Terms:

32

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T24

Trade Compliance

TIFPLA840CNT3 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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