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TIFPLA840MFK

Texas Instruments

TIFPLA840MFK by Texas Instruments

TIFPLA840MFK by Texas Instruments is a TTL technology PLD with 30 ns propagation delay, 14 inputs, and 6 outputs. It is used in military applications due to its MILITARY grading, -55 to 125 °C operating temperature range, and COMBINATORIAL output function.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,313 parts In-Stock

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Vyrian

USA . 3,226 parts In-Stock

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3,226

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Distributors (Availability)

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One Stop Electronics

USA . 1,233 parts In-Stock

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$5.000

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$5.000

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AZTECH Wire

Italy . 250 parts In-Stock

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$12.351

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$12.351

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Parana Technologies

USA . 1,801 parts In-Stock

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$158.072

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$158.072

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DigiPath Technology Company

USA . 1,054 parts In-Stock

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$174.057

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$160.132

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$174.057

$160.132

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ChromeModa Solutions

Germany . 5,870 parts In-Stock

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$177.609

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$145.639

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5,870

$177.609

$145.639

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IDEA Electronic Components Group

UK . 1,657 parts In-Stock

1+ parts

$177.609

100+ parts

$168.729

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$159.848

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1,657

$177.609

$168.729

$159.848

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Corphita

USA . 4,705 parts In-Stock

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Overview

Unleash the power of innovation with the Texas Instruments TIFPLA840MFK Programmable Logic Device. Crafted with precision using high-quality materials and advanced technology, this PLA-type IC offers unparalleled performance and reliability. Whether you're designing cutting-edge electronics or optimizing existing systems, the TIFPLA840MFK delivers lightning-fast response times and seamless integration. Elevate your projects and unlock endless possibilities with this military-grade solution that brings your ideas to life. Choose Texas Instruments for superior quality and unmatched value in programmable logic devices.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material provides durability and robustness, making the product suitable for harsh environments.

Propagation Delay: 30 ns

With a low propagation delay of 30 ns, this PLD offers fast processing speeds, ideal for time-sensitive applications.

Surface Mount: YES

The surface mount capability allows for easy integration into PCB designs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V provides flexibility in power supply options, accommodating a wide range of applications.

Technology Used: TTL

The use of TTL technology ensures compatibility with TTL logic levels, making it easy to interface with other TTL-based systems.

No. of Inputs: 14

Having 14 inputs allows for versatile input configurations, enabling the PLD to handle a variety of logic functions.

Package Shape: SQUARE

The square package shape offers a compact form factor, optimizing space utilization in system designs.

Form Of Terminal: NO LEAD

The no lead terminal design simplifies installation and reduces the risk of soldering errors during assembly.

Architecture: PLA-TYPE

The PLA-type architecture provides programmable logic array functionality, offering flexibility in defining logic functions.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V is a standard level used in many electronic systems, ensuring compatibility with existing designs.

Power Supplies (V): 5

Having a single power supply voltage simplifies the design and operation of the PLD, reducing complexity in power management.

No. of Terminals: 28

With 28 terminals, this PLD offers sufficient connectivity options for interfacing with other components in a system.

Programmable IC Type: OT PLD

Being an OTP PLD (One-Time Programmable), this device allows for programming of logic functions without the need for reprogramming, offering a cost-effective solution for fixed logic applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides ease of handling and protection for the PLD, ensuring reliable performance in various operating conditions.

Output Function: COMBINATORIAL

The combinatorial output function allows for simple logic operations, making this PLD suitable for basic logical processing tasks.

No. of Product Terms: 32

Having 32 product terms offers flexibility in defining complex logic functions, enabling the PLD to handle a wide range of logical operations.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V ensures compatibility with lower voltage systems, providing flexibility in power requirements.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this PLD can withstand elevated temperatures, making it suitable for industrial and automotive applications.

Pitch Of Terminal: 1.27 mm

The 1.27 mm terminal pitch facilitates easy connections and PCB layout, simplifying the design and assembly process.

Organization: 14 DEDICATED INPUTS, 0 I/O

Having 14 dedicated inputs and no I/O terminals allows for focused input processing capabilities, streamlining logic functions.

No. of Dedicated Inputs: 14

The 14 dedicated inputs provide specific input channels for different logic operations, enhancing versatility in logic processing.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature of -55°C, this PLD can operate in extreme cold environments, expanding its range of applications.

Position Of Terminal: QUAD

The quad position of terminals simplifies connections and ensures proper alignment, facilitating easy installation and PCB layout.

Maximum Seated Height: 2.03 mm

The low maximum seated height of 2.03 mm allows for compact integration in tight spaces, optimizing system layout and design.

Width: 11.43 mm

The width of 11.43 mm offers a compact form factor, enabling efficient utilization of space in system layouts and designs.

No. of Outputs: 6

With 6 outputs, this PLD can provide multiple logic outputs for diverse logic processing requirements, enhancing versatility in logic operations.

Length: 11.43 mm

The length of 11.43 mm complements the compact width, offering a space-efficient package size for integration in various electronic systems.

Grading Of Temperature: MILITARY

The military-grade temperature rating ensures reliable performance in extreme environmental conditions, making this PLD suitable for rugged applications.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA840MFK attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Combinatorial

No. of Inputs:

14

No. of Product Terms:

32

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC28,.45SQ

Width:

11.43 mm

Length:

11.43 mm

Maximum Seated Height:

2.03 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-N28

Qualified:

No

Trade Compliance

TIFPLA840MFK Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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