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TIFPLA839CNT3

Texas Instruments

TIFPLA839CNT3 by Texas Instruments

TIFPLA839CNT3 by Texas Instruments is a TTL technology-based Programmable Logic Device with 14 inputs and 6 outputs. It operates at a nominal voltage of 5V, suitable for commercial applications requiring up to 32 product terms in a PLA-type architecture. The device comes in an inline package style with through-hole terminals, making it ideal for various digital logic design projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,465 parts In-Stock

1+ parts

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6,465

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Digiode

USA . 1,001 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,001

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,548 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

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10k+ parts

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1,548

$12.000

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AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$15.769

100+ parts

-

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235

$15.769

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Parana Technologies

USA . 190 parts In-Stock

1+ parts

$160.097

100+ parts

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190

$160.097

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DigiPath Technology Company

USA . 904 parts In-Stock

1+ parts

$176.286

100+ parts

$162.183

1k+ parts

-

10k+ parts

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904

$176.286

$162.183

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ChromeModa Solutions

Germany . 1,618 parts In-Stock

1+ parts

$179.884

100+ parts

$147.505

1k+ parts

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10k+ parts

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1,618

$179.884

$147.505

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IDEA Electronic Components Group

UK . 315 parts In-Stock

1+ parts

$179.884

100+ parts

$170.890

1k+ parts

$161.896

10k+ parts

-

315

$179.884

$170.890

$161.896

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Corphita

USA . 192 parts In-Stock

1+ parts

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192

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Overview

Unlock endless possibilities with the TIFPLA839CNT3 by Texas Instruments, a top-of-the-line Programmable Logic Device that offers unparalleled quality and reliability. Designed with cutting-edge technology and precision engineering, this device is ideal for a wide range of applications. From enhancing efficiency in industrial automation to optimizing performance in consumer electronics, the TIFPLA839CNT3 delivers unmatched value and versatility. Trust Texas Instruments for superior products that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments and handling conditions.

Technology Used: TTL

TTL technology offers fast operation speeds and low power consumption, making the product efficient and reliable for different applications.

No. of Inputs: 14

Having 14 inputs allows for versatility and flexibility in designing complex logic circuits and functions.

Package Shape: RECTANGULAR

The rectangular shape enables easy integration and placement within electronic circuits and systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide secure connections and are suitable for manual soldering, enhancing ease of installation and maintenance.

Architecture: PLA-TYPE

PLA architecture offers programmable logic flexibility and customization, allowing for specific logic functions to be implemented as needed.

Nominal Supply Voltage (V): 5

Operating at a 5V supply voltage ensures compatibility with standard electronic systems and components, making integration seamless.

No. of Terminals: 24

With 24 terminals, the product offers sufficient connectivity options for interfacing with other devices and components in a circuit.

Programmable IC Type: OT PLD

The OT PLD programmable IC type allows for versatile programming capabilities, enabling custom logic designs and configurations.

Package Style (Meter): IN-LINE

The in-line package style offers space-saving benefits and easy alignment with other components on a circuit board.

No. of Product Terms: 32

Having 32 product terms provides flexibility in implementing various logic functions and operations, enhancing the versatility of the product.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliability and stability in diverse operating conditions and environments.

Pitch Of Terminal: 2.54 mm

A terminal pitch of 2.54 mm allows for easy connections and compatibility with standard electronic components, facilitating integration.

Minimum Operating Temperature: 0 °C

Being able to operate at a minimum temperature of 0°C ensures functionality in a wide range of environmental conditions.

Position Of Terminal: DUAL

Dual-position terminals offer redundancy and reliability in connections, ensuring secure and stable electrical interfaces.

No. of Outputs: 6

Having 6 outputs allows for the product to drive multiple external devices or components simultaneously, enhancing its functionality and application range.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures compatibility with standard operating environments and ensures reliable performance in commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA839CNT3 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

6

No. of Inputs:

14

No. of Product Terms:

32

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T24

Trade Compliance

TIFPLA839CNT3 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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