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TIFPLA839CJT

Texas Instruments

TIFPLA839CJT by Texas Instruments

TIFPLA839CJT by Texas Instruments is a TTL technology PLD with 20 ns propagation delay and 5.25 V max supply voltage. It features 14 dedicated inputs, 6 outputs, and is ideal for applications requiring combinatorial output functions in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,505 parts In-Stock

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6,505

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Digiode

USA . 3,871 parts In-Stock

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3,871

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$10.383

100+ parts

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352

$10.383

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One Stop Electronics

USA . 223 parts In-Stock

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$12.000

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223

$12.000

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Parana Technologies

USA . 841 parts In-Stock

1+ parts

$42.114

100+ parts

$3,910.915

1k+ parts

$37.903

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841

$42.114

$3,910.915

$37.903

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DigiPath Technology Company

USA . 1,097 parts In-Stock

1+ parts

$46.373

100+ parts

$42.663

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1,097

$46.373

$42.663

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ChromeModa Solutions

Germany . 5,992 parts In-Stock

1+ parts

$47.319

100+ parts

$38.802

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5,992

$47.319

$38.802

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IDEA Electronic Components Group

UK . 569 parts In-Stock

1+ parts

$47.319

100+ parts

$44.953

1k+ parts

$42.587

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569

$47.319

$44.953

$42.587

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Corphita

USA . 1,793 parts In-Stock

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1,793

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Overview

Upgrade your electronic projects with the TIFPLA839CJT by Texas Instruments! Manufactured by a trusted name in the industry, this Programmable Logic Device offers fast propagation delay and a wide range of applications. Whether you're working on industrial automation or consumer electronics, this PLD provides high-quality performance and reliability. With 14 dedicated inputs and 6 outputs, you'll have the flexibility to customize your designs with ease. Experience the value and benefits of using Texas Instruments' top-notch technology in your next project!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability for the product.

Propagation Delay: 20 ns

Fast propagation delay allows for quick processing of signals within the device.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility and compatibility with various power sources.

Technology Used: TTL

TTL technology offers high-speed performance and low power consumption.

No. of Inputs: 14

Having 14 inputs allows for versatile connectivity and input options.

Architecture: PLA-TYPE

PLA-type architecture offers programmability and flexibility for custom logic functions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can function effectively in a variety of environmental conditions.

No. of Outputs: 6

Having 6 outputs enables the device to control multiple external components or systems.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA839CJT attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Combinatorial

No. of Inputs:

14

No. of Product Terms:

32

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Propagation Delay:

20 ns

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T24

Qualified:

No

Trade Compliance

TIFPLA839CJT Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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