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TIFPLA840CJT

Texas Instruments

TIFPLA840CJT by Texas Instruments

TIFPLA840CJT by Texas Instruments is a TTL technology PLD with 25 ns propagation delay and 5.25 V max supply voltage. It features 14 dedicated inputs, 6 outputs, and supports combinatorial output function. Ideal for commercial applications requiring fast processing speed and high input/output capacity in a ceramic, glass-sealed package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,759 parts In-Stock

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3,759

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Vyrian

USA . 2,161 parts In-Stock

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2,161

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Distributors (Availability)

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One Stop Electronics

USA . 1,159 parts In-Stock

1+ parts

$5.000

100+ parts

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1,159

$5.000

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AZTECH Wire

Italy . 327 parts In-Stock

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$5.946

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327

$5.946

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Parana Technologies

USA . 1,518 parts In-Stock

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$165.279

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1,518

$165.279

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DigiPath Technology Company

USA . 1,279 parts In-Stock

1+ parts

$181.993

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$167.433

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1,279

$181.993

$167.433

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IDEA Electronic Components Group

UK . 1,370 parts In-Stock

1+ parts

$185.707

100+ parts

$176.422

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$167.136

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1,370

$185.707

$176.422

$167.136

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ChromeModa Solutions

Germany . 1,160 parts In-Stock

1+ parts

$185.707

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$152.280

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1,160

$185.707

$152.280

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Corphita

USA . 3,046 parts In-Stock

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3,046

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Overview

Unlock endless possibilities with the TIFPLA840CJT by Texas Instruments, a top-tier manufacturer in the realm of Programmable Logic Devices. This cutting-edge device offers lightning-fast propagation delay and a wide supply voltage range, making it perfect for a variety of applications. With 32 product terms and 6 outputs, this PLA-type IC provides unparalleled flexibility and performance. Elevate your projects to new heights with the TIFPLA840CJT and experience the quality, reliability, and innovation that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the internal components, ensuring reliability in various operating conditions.

Propagation Delay: 25 ns

The low propagation delay of 25 ns ensures fast signal processing and responsiveness, making it suitable for applications requiring high-speed operations.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V allows for flexibility in power supply options and compatibility with different voltage levels in the system.

Technology Used: TTL

The use of TTL technology ensures compatibility with other TTL logic devices, simplifying integration and communication within the system.

No. of Inputs: 14

With 14 inputs, this PLD offers versatility in handling multiple input signals, enabling complex logic operations and designs.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of handling and installation, making it convenient for mounting on circuit boards or in electronic systems.

Form Of Terminal: THROUGH-HOLE

The through-hole form of terminal ensures secure connections and soldering, enhancing the reliability and stability of the PLD in the circuit.

Architecture: PLA-TYPE

The PLA-type architecture offers programmable logic capabilities, allowing for custom logic functions to be implemented based on the specific requirements of the application.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V is commonly used in many electronic systems, ensuring compatibility and ease of integration with existing components.

Power Supplies (V): 5

The availability of power supplies at 5 V ensures stable and reliable operation of the PLD, meeting the power requirements of the logic functions.

No. of Terminals: 24

With 24 terminals, this PLD offers sufficient connectivity options for input, output, and power connections, enabling versatile circuit designs.

Programmable IC Type: OT PLD

Being an OT (Output Terminal) PLD, this device focuses on providing flexible output configurations, allowing for diverse output functions and possibilities.

Package Style (Meter): IN-LINE

The in-line package style facilitates space-efficient arrangement on circuit boards, optimizing the use of available board real estate and enabling compact system designs.

Output Function: COMBINATORIAL

The combinatorial output function supports logic operations that combine multiple input signals to generate the desired output, offering flexibility in implementing logic functions.

No. of Product Terms: 32

With 32 product terms, this PLD can accommodate a wide range of logic functions and complex operations, making it suitable for diverse applications.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage of 4.75 V ensures efficient power consumption and compatibility with lower voltage sources, enhancing energy efficiency.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows for reliable performance in elevated temperature environments, suitable for industrial and automotive applications.

Pitch Of Terminal: 2.54 mm

The 2.54 mm pitch of terminals enables compatibility with standard spacing on circuit boards and connectors, facilitating easy connections and installations.

Organization: 14 DEDICATED INPUTS, 0 I/O

The organization of 14 dedicated inputs and 0 I/O ensures focused input processing and logic operations, simplifying the design and configuration of the PLD.

No. of Dedicated Inputs: 14

The 14 dedicated inputs allow for targeted input signal handling, enhancing the efficiency and performance of the PLD in processing specific logic functions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable operation in a wide range of environmental conditions, making the PLD suitable for various applications.

Position Of Terminal: DUAL

The dual position of terminals provides flexibility in mounting and connection options, allowing for versatile placement and orientation in the circuit layout.

No. of Outputs: 6

With 6 outputs, this PLD can drive multiple output signals and devices, supporting diverse output configurations and functions for complex logic operations.

Grading Of Temperature: COMMERCIAL

The commercial-grade temperature grading ensures reliable performance under typical operating conditions, suitable for commercial and general-purpose applications.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA840CJT attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Combinatorial

No. of Inputs:

14

No. of Product Terms:

32

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T24

Qualified:

No

Trade Compliance

TIFPLA840CJT Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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