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TIFPLA839CFN

Texas Instruments

TIFPLA839CFN by Texas Instruments

TIFPLA839CFN by Texas Instruments is a TTL technology Programmable Logic Device with 14 inputs and 6 outputs. It has a propagation delay of 20 ns, operates at a supply voltage range of 4.75V to 5.25V, and is used for combinatorial output functions in commercial applications.

Median Price

$5.813

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 491 parts In-Stock

1+ parts

-

100+ parts

$4.650

1k+ parts

$4.160

10k+ parts

$3.910

491

-

$4.650

$4.160

$3.910

DigiKey

USA . 491 parts In-Stock

1+ parts

-

100+ parts

$6.110

1k+ parts

-

10k+ parts

-

491

-

$6.110

-

-

Verical

USA . 491 parts In-Stock

1+ parts

-

100+ parts

$5.813

1k+ parts

$5.200

10k+ parts

$4.888

491

-

$5.813

$5.200

$4.888

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,540 parts In-Stock

1+ parts

$4.912

100+ parts

-

1k+ parts

-

10k+ parts

-

1,540

$4.912

-

-

-

Vyrian

USA . 3,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,875

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 970 parts In-Stock

1+ parts

$4.653

100+ parts

-

1k+ parts

-

10k+ parts

-

970

$4.653

-

-

-

Parana Technologies

USA . 1,622 parts In-Stock

1+ parts

$84.432

100+ parts

-

1k+ parts

-

10k+ parts

-

1,622

$84.432

-

-

-

DigiPath Technology Company

USA . 1,628 parts In-Stock

1+ parts

$92.970

100+ parts

$85.532

1k+ parts

-

10k+ parts

-

1,628

$92.970

$85.532

-

-

IDEA Electronic Components Group

UK . 739 parts In-Stock

1+ parts

$94.867

100+ parts

$90.124

1k+ parts

$85.380

10k+ parts

-

739

$94.867

$90.124

$85.380

-

ChromeModa Solutions

Germany . 338 parts In-Stock

1+ parts

$94.867

100+ parts

$77.791

1k+ parts

-

10k+ parts

-

338

$94.867

$77.791

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

29,745

-

-

-

-

Overview

Unlock the potential of your electronic projects with the TIFPLA839CFN by Texas Instruments, a high-quality Programmable Logic Device that offers unmatched reliability and performance. Manufactured by the industry leader in semiconductor technology, this PLD is perfect for a wide range of applications, providing fast propagation delay and versatile output functions. With 14 dedicated inputs and 6 outputs, this chip carrier package is designed for ease of use and maximum efficiency. Elevate your designs with Texas Instruments and experience the value and benefits of cutting-edge technology in every project you undertake.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay: 20 ns

The low propagation delay ensures fast processing of signals, making this PLD suitable for high-speed applications.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power input, accommodating a wider range of voltage requirements.

Technology Used: TTL

TTL technology offers reliable and robust performance, making this PLD suitable for a variety of industrial and commercial applications.

No. of Inputs: 14

With 14 inputs, this PLD can accommodate multiple input signals, making it versatile for complex logic operations.

No. of Outputs: 6

The 6 outputs provide ample options for routing logic signals to external components, enhancing the functionality of the PLD.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA839CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Combinatorial

No. of Inputs:

14

No. of Product Terms:

32

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Propagation Delay:

20 ns

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Width:

11.5062 mm

Length:

11.5062 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

TIFPLA839CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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