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TIFPLA840MFH

Texas Instruments

TIFPLA840MFH by Texas Instruments

TIFPLA840MFH by Texas Instruments is a TTL technology PLD with 30 ns propagation delay, 14 inputs, and 6 outputs. It is used in military applications due to its MIL grading, combinatorial output function, and operating temperature range of -55 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,699 parts In-Stock

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4,699

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Vyrian

USA . 1,995 parts In-Stock

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1,995

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Distributors (Availability)

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AZTECH Wire

Italy . 405 parts In-Stock

1+ parts

$5.096

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405

$5.096

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One Stop Electronics

USA . 1,396 parts In-Stock

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$14.000

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1,396

$14.000

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Parana Technologies

USA . 485 parts In-Stock

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$17.308

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$17.519

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485

$17.308

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$17.519

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DigiPath Technology Company

USA . 975 parts In-Stock

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$19.058

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$17.533

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975

$19.058

$17.533

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IDEA Electronic Components Group

UK . 1,071 parts In-Stock

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$19.447

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$18.475

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$17.502

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1,071

$19.447

$18.475

$17.502

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ChromeModa Solutions

Germany . 844 parts In-Stock

1+ parts

$19.447

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$15.947

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844

$19.447

$15.947

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Corphita

USA . 2,855 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TIFPLA840MFH by Texas Instruments, a top-of-the-line Programmable Logic Device that offers unmatched quality and reliability. Created by one of the industry's leading manufacturers, this PLD is perfect for a wide range of applications, delivering lightning-fast performance and exceptional efficiency. With its advanced features and innovative design, the TIFPLA840MFH provides customers with unparalleled value and benefits, making it the ideal choice for all your programmable IC needs. Upgrade your projects today with this high-quality product that is guaranteed to exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability, making this product suitable for harsh environments.

Propagation Delay: 30 ns

With a fast propagation delay of 30 ns, this PLD offers high-speed performance for time-critical applications.

Surface Mount: YES

Being surface mountable makes installation and assembly easier, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5 V allows flexibility in power requirements for various circuit designs.

Technology Used: TTL

The use of TTL technology ensures compatibility with a wide range of digital systems, enhancing integration and interoperability.

No. of Inputs: 14

Having 14 inputs provides ample connectivity options, allowing for versatile input configurations in the logic design.

Package Shape: SQUARE

The square package shape offers efficient use of PCB real estate, optimizing space utilization in the overall system design.

Form Of Terminal: J BEND

The J bend terminal design facilitates secure and stable connections, minimizing the risk of disconnection or signal loss.

Architecture: PLA-TYPE

The PLA-type architecture offers programmability and flexibility in defining logic functions, enabling customization and adaptability in the circuit design.

Nominal Supply Voltage (V): 5

A nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying integration into existing systems.

Power Supplies (V): 5

Consistent power supply at 5 V promotes stable operation and reliable performance, contributing to the overall robustness of the device.

No. of Terminals: 28

With 28 terminals, this PLD offers versatile connectivity options, allowing for a wide range of input and output configurations in the circuit.

Programmable IC Type: OT PLD

The OT PLD type allows for programmability, giving users the ability to customize logic functions and optimize performance for specific applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and ease of handling during installation, making it suitable for space-constrained environments.

Output Function: COMBINATORIAL

The combinatorial output function enables the creation of complex logical operations, facilitating the implementation of intricate circuit designs.

No. of Product Terms: 32

With 32 product terms, this PLD provides extensive logic capabilities, supporting the implementation of intricate digital functions and algorithms.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V offers flexibility in power requirements, accommodating a range of voltage levels for different applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this PLD can withstand high-temperature environments, ensuring reliable performance in harsh conditions.

Pitch Of Terminal: 1.27 mm

The 1.27 mm pitch of the terminal spacing allows for precise and compact layout designs, optimizing PCB space and enhancing circuit density.

Organization: 14 DEDICATED INPUTS, 0 I/O

The organization of 14 dedicated inputs and 0 I/O terminals provides focused input processing capabilities, simplifying logic design and optimization.

No. of Dedicated Inputs: 14

The presence of 14 dedicated inputs ensures efficient signal processing and routing, enhancing the performance and flexibility of the PLD.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this PLD is capable of functioning in extreme cold environments, making it suitable for a wide range of applications.

Position Of Terminal: QUAD

The quad position of the terminals offers uniform and organized connectivity, simplifying installation and maintenance procedures for the PLD.

Maximum Seated Height: 2.54 mm

The maximum seated height of 2.54 mm ensures compatibility with standard PCB designs and mounting configurations, promoting ease of integration in electronic systems.

Width: 11.43 mm

The width of 11.43 mm provides a compact form factor, enabling efficient use of space on the PCB and promoting overall system miniaturization.

No. of Outputs: 6

Having 6 outputs offers versatility in signal routing and processing, allowing for diverse output configurations to meet various application requirements.

Length: 11.43 mm

The length of 11.43 mm contributes to the compactness of the PLD, making it suitable for applications where space is limited or where miniaturization is necessary.

Grading Of Temperature: MILITARY

The military-grade temperature grading ensures high reliability and performance in extreme temperature conditions, making this PLD suitable for demanding military and aerospace applications.

Technical Specifications

Programmable Logic Devices (PLD) TIFPLA840MFH attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Combinatorial

No. of Inputs:

14

No. of Product Terms:

32

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PLA-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Metal-Sealed Cofired

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LCC28,.45SQ

Width:

11.43 mm

Length:

11.43 mm

Maximum Seated Height:

2.54 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-CQCC-J28

Qualified:

No

Trade Compliance

TIFPLA840MFH Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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