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TIBPALR19R4CFN

Texas Instruments

TIBPALR19R4CFN by Texas Instruments

TIBPALR19R4CFN by Texas Instruments is a PAL-TYPE PLD with 25ns propagation delay, 5.25V max supply voltage, and 30MHz clock frequency. Ideal for applications requiring mixed output functions in commercial temperature environments.

Median Price

$5.813

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 169 parts In-Stock

1+ parts

-

100+ parts

$4.650

1k+ parts

$4.160

10k+ parts

$3.910

169

-

$4.650

$4.160

$3.910

DigiKey

USA . 169 parts In-Stock

1+ parts

-

100+ parts

$6.110

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169

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$6.110

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Verical

USA . 169 parts In-Stock

1+ parts

-

100+ parts

$5.813

1k+ parts

$5.200

10k+ parts

$4.888

169

-

$5.813

$5.200

$4.888

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,265 parts In-Stock

1+ parts

$4.912

100+ parts

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3,265

$4.912

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Bristol Electronics

USA . 25 parts In-Stock

1+ parts

$10.200

100+ parts

$6.885

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-

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25

$10.200

$6.885

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Vyrian

USA . 5,628 parts In-Stock

1+ parts

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5,628

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DigiKey Marketplace

USA . 169 parts In-Stock

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169

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Microfarads

USA . 24 parts In-Stock

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,929 parts In-Stock

1+ parts

$4.653

100+ parts

-

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1,929

$4.653

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Parana Technologies

USA . 1,558 parts In-Stock

1+ parts

$127.964

100+ parts

-

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1,558

$127.964

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DigiPath Technology Company

USA . 1,992 parts In-Stock

1+ parts

$140.904

100+ parts

$129.632

1k+ parts

-

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1,992

$140.904

$129.632

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ChromeModa Solutions

Germany . 6,774 parts In-Stock

1+ parts

$143.780

100+ parts

$117.900

1k+ parts

-

10k+ parts

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6,774

$143.780

$117.900

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IDEA Electronic Components Group

UK . 374 parts In-Stock

1+ parts

$143.780

100+ parts

$136.591

1k+ parts

$129.402

10k+ parts

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374

$143.780

$136.591

$129.402

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Overview

Unlock endless possibilities with the TIBPALR19R4CFN by Texas Instruments, a high-quality Programmable Logic Device perfect for a wide range of applications. Manufactured by industry leader Texas Instruments, this PLD offers unparalleled reliability and performance. With its fast propagation delay and versatile architecture, this chip is ideal for creating custom logic functions in various electronic systems. Experience the value and benefits of this innovative product, whether you're designing consumer electronics or industrial automation solutions. Trust Texas Instruments to deliver cutting-edge technology that empowers your creativity and enhances your projects.

Feature Benefit Bullets

Propagation Delay: 25 ns

Low propagation delay ensures fast response time, making this PLD suitable for applications requiring quick processing.

Technology Used: TTL

TTL technology ensures compatibility with a wide range of existing systems and devices, enhancing the versatility of this PLD.

No. of Inputs: 19

With a high number of inputs, this PLD can accommodate a larger number of signals and data inputs, making it suitable for complex applications.

Nominal Supply Voltage (V): 5

Stable and standard supply voltage of 5V ensures reliable operation of the PLD in various conditions.

No. of Outputs: 8

Multiple output options provide flexibility in routing signals and data, making this PLD versatile for a variety of applications.

Technical Specifications

Programmable Logic Devices (PLD) TIBPALR19R4CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

0 Dedicated Inputs, 4 I/O

No. of Outputs:

8

Output Function:

Mixed

No. of Inputs:

19

No. of Product Terms:

64

No. of Dedicated Inputs:

0

No. of I/O Lines:

4

Maximum Clock Frequency:

30 MHz

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

1 External Clock; Register Preload

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Width:

11.5062 mm

Length:

11.5062 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

TIBPALR19R4CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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