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TI380FPAAFN

Texas Instruments

TI380FPAAFN by Texas Instruments

TI380FPAAFN by Texas Instruments is a CMOS MICROPROCESSOR CIRCUIT with 52 terminals, operating at 0-70 °C. It has a supply voltage range of 4.75-5.25 V and comes in a square CHIP CARRIER package style. Ideal for various applications requiring high-performance processing capabilities in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,188 parts In-Stock

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Digiode

USA . 1,096 parts In-Stock

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1,096

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Distributors (Availability)

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One Stop Electronics

USA . 1,612 parts In-Stock

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$17.000

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1,612

$17.000

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AZTECH Wire

Italy . 304 parts In-Stock

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$19.518

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304

$19.518

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Corohmni

South Africa . 673 parts In-Stock

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$63.994

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673

$63.994

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Parana Technologies

USA . 2,255 parts In-Stock

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$72.883

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2,255

$72.883

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DigiPath Technology Company

USA . 48 parts In-Stock

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$80.253

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$73.833

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48

$80.253

$73.833

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ChromeModa Solutions

Germany . 3,228 parts In-Stock

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$81.891

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$67.151

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$81.891

$67.151

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IDEA Electronic Components Group

UK . 1,141 parts In-Stock

1+ parts

$81.891

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$77.796

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$73.702

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1,141

$81.891

$77.796

$73.702

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A-Z Elektronik GmbH

Germany . 5,624 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,501 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TI380FPAAFN by Texas Instruments. As a leader in innovation, Texas Instruments consistently delivers superior quality products that exceed industry standards. This versatile microprocessor circuit boasts a wide range of applications, making it ideal for various projects. Experience seamless integration and reliable performance with this chip carrier package. Trust Texas Instruments to provide unmatched value and benefits, ensuring you stay ahead of the competition. Elevate your designs with the TI380FPAAFN and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, saving time and cost in production.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage provides flexibility in power input options for various applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, optimizing layout and design.

No. of Terminals: 52

The high number of terminals enables versatile connectivity options and functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal performance and enhanced reliability in operation.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures reliable performance even in harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in various temperature conditions without performance degradation.

Terminal Position: QUAD

The quad terminal position offers efficient connectivity and soldering capabilities for reliable connections.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for compact and slim device designs.

Width: 19.1262 mm

The specific width measurement ensures proper fit and compatibility in PCB layouts.

Length: 19.1262 mm

The specific length measurement ensures proper fit and compatibility in PCB layouts.

Temperature Grade: COMMERCIAL

The commercial temperature grade is suitable for standard commercial applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

The use of a microprocessor circuit enhances the product's processing capabilities and functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: J BEND

The J bend terminal form allows for secure connection and easy soldering during assembly.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electronic devices, ensuring compatibility.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density mounting and compact PCB design.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TI380FPAAFN attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J52

Length:

19.1262 mm

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.1262 mm

Peripheral IC Type:

Trade Compliance

TI380FPAAFN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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