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TI380FPAFNLR

Texas Instruments

TI380FPAFNLR by Texas Instruments

TI380FPAFNLR by Texas Instruments is a 52-terminal MICROPROCESSOR CIRCUIT in a SQUARE CHIP CARRIER package. It operates b/w 0-70 °C with supply voltage range of 4.75-5.25 V, making it ideal for commercial applications requiring CMOS technology and J BEND terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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MRC Electronics

USA . 7,358 parts In-Stock

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Vyrian

USA . 7,332 parts In-Stock

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7,332

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Digiode

USA . 1,738 parts In-Stock

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Semi Source

USA . 188 parts In-Stock

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188

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One Stop Electronics

USA . 1,030 parts In-Stock

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$10.000

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$10.000

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AZTECH Wire

Italy . 268 parts In-Stock

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$13.751

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268

$13.751

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Parana Technologies

USA . 1,148 parts In-Stock

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$21.962

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$22.481

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$21.962

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$22.481

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DigiPath Technology Company

USA . 2,077 parts In-Stock

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$24.182

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$22.248

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2,077

$24.182

$22.248

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ChromeModa Solutions

Germany . 3,203 parts In-Stock

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$24.676

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$20.234

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IDEA Electronic Components Group

UK . 1,643 parts In-Stock

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$24.676

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$23.442

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$22.208

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1,643

$24.676

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$22.208

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Corohmni

South Africa . 3,066 parts In-Stock

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$69.336

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Corphita

USA . 3,647 parts In-Stock

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Overview

Elevate your electronic projects with the TI380FPAFNLR by Texas Instruments, a cutting-edge microprocessor circuit that offers unparalleled quality and reliability. Manufactured by a trusted industry leader, this chip carrier packaged peripheral IC provides a wide range of applications in the world of Other Function uPs,uCs & Peripheral ICs. With a maximum supply voltage of 5.25V and a commercial temperature grade, this versatile device is perfect for various projects. Experience the value and benefits of Texas Instruments technology with the TI380FPAFNLR – where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide good durability and thermal properties, making this product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, saving time and reducing costs.

Maximum Supply Voltage: 5.25 V

Ability to handle higher supply voltages provides flexibility and reliability in various operating conditions.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space, especially in applications where size constraints are a concern.

No. of Terminals: 52

Higher number of terminals allows for more connections and functionalities to be supported, making this product versatile for complex designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packages offer good protection for the IC and efficient heat dissipation, ensuring reliability and longevity.

Minimum Supply Voltage: 4.75 V

Wide range of supply voltage support allows for operation in different power conditions, enhancing compatibility with various systems.

Maximum Operating Temperature: 70 °C

High operating temperature tolerance ensures reliable performance in demanding environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

Low operating temperature limit allows for use in cold environments without risking damage or malfunction.

Terminal Position: QUAD

Quad terminal configuration simplifies PCB layout and facilitates easier connection and soldering during assembly.

Maximum Seated Height: 4.57 mm

Low profile design with maximum seated height enables compact and sleek device designs.

Width: 19.13 mm

Moderate width size provides a balance between space utilization and ease of handling during installation or maintenance.

Length: 19.13 mm

Moderate length size offers flexibility in PCB layout and integration within various device enclosures.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard commercial environments, suitable for most applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Inclusion of microprocessor circuit enhances the product's processing capabilities and functionality, enabling advanced control and computation tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this product energy-efficient and reliable.

Terminal Form: J BEND

J bend terminals provide secure mechanical connection and facilitate efficient soldering, ensuring robust and stable electrical contacts.

Nominal Supply Voltage: 5 V

Nominal 5V supply voltage standardizes power requirements and compatibility with many electronic systems and devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration with off-the-shelf components and PCB designs, simplifying system assembly and maintenance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TI380FPAFNLR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J52

Length:

19.13 mm

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.13 mm

Peripheral IC Type:

Trade Compliance

TI380FPAFNLR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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