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TI380FPAFNL

Texas Instruments

TI380FPAFNL by Texas Instruments

TI380FPAFNL by Texas Instruments is a CMOS microprocessor circuit with 52 terminals in a square chip carrier package. It operates b/w 0-70°C, with supply voltage range of 4.75-5.25 V. Ideal for applications requiring high-performance peripheral ICs in commercial temperature grade environments.

Median Price

$13.500

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Ace Electronics

USA . 38 parts In-Stock

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$10.000

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Bristol Electronics

USA . 725 parts In-Stock

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$13.500

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$7.763

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American Microsemiconductor Inc.

USA . 22 parts In-Stock

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$63.250

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Vyrian

USA . 3,846 parts In-Stock

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Digiode

USA . 1,561 parts In-Stock

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A2Z Electronics, Inc.

USA . 690 parts In-Stock

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Q Components

USA . 391 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 243 parts In-Stock

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PC Components Company LLC

USA . 200 parts In-Stock

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Speed Components Ltd

Israel . 18 parts In-Stock

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Prism Electronics

USA . 15 parts In-Stock

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MRC Electronics

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AZTECH Wire

Italy . 610 parts In-Stock

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$5.186

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One Stop Electronics

USA . 1,568 parts In-Stock

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$9.000

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Corohmni

South Africa . 5,085 parts In-Stock

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$29.070

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Parana Technologies

USA . 462 parts In-Stock

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$38.068

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DigiPath Technology Company

USA . 1,678 parts In-Stock

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$41.918

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ChromeModa Solutions

Germany . 4,226 parts In-Stock

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$42.773

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$35.074

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IDEA Electronic Components Group

UK . 2,063 parts In-Stock

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$42.773

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$40.634

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$38.496

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Corphita

USA . 913 parts In-Stock

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Emar International I/E

Canada . 296 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 92 parts In-Stock

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Assy Fe

Spain . 18 parts In-Stock

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Perfect Parts

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Overview

Experience the unparalleled quality and innovation of Texas Instruments with the TI380FPAFNL. This cutting-edge product falls under the category of Other Function uPs,uCs & Peripheral ICs, offering customers a wide range of applications in various industries. Designed with precision and reliability in mind, this chip carrier package boasts a square shape and 52 terminals, ensuring seamless integration into any project. With a minimum supply voltage of 4.75V and maximum supply voltage of 5.25V, the TI380FPAFNL delivers top-notch performance even in challenging conditions. Trust Texas Instruments to provide you with exceptional value and unmatched benefits for all your microprocessor circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation onto circuit boards.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power supply options.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards.

No. of Terminals: 52

With 52 terminals, this product offers a wide range of connection options for peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style allows for easy handling and installation of the product.

Minimum Supply Voltage: 4.75 V

Lower minimum supply voltage ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature provides reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in colder temperatures.

Terminal Position: QUAD

Quad terminal position allows for efficient connection and communication with other components.

Maximum Seated Height: 4.57 mm

Low maximum seated height saves space and allows for compact designs.

Width: 19.13 mm

19.13 mm width provides a balance between compact size and functionality.

Length: 19.13 mm

19.13 mm length ensures a square form factor for uniformity in design.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with a wide range of applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type offers advanced processing capabilities for enhanced performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: J BEND

J bend terminal form allows for secure and reliable connections.

Nominal Supply Voltage: 5 V

5V nominal supply voltage ensures compatibility with standard power sources.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch offers efficient spacing for easy connections.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TI380FPAFNL attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J52

Length:

19.13 mm

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.13 mm

Peripheral IC Type:

Trade Compliance

TI380FPAFNL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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