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TI380FPAA

Texas Instruments

TI380FPAA by Texas Instruments

TI380FPAA by Texas Instruments is a 52-terminal microprocessor circuit with CMOS technology. It operates b/w 0-70°C, with supply voltage range of 4.75-5.25 V. Ideal for applications requiring a square chip carrier package in commercial temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,865 parts In-Stock

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3,865

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Digiode

USA . 1,398 parts In-Stock

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1,398

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Distributors (Availability)

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AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$9.392

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410

$9.392

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Parana Technologies

USA . 1,271 parts In-Stock

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$20.031

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$19.963

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1,271

$20.031

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$19.963

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ChromeModa Solutions

Germany . 3,658 parts In-Stock

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$22.507

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$18.456

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3,658

$22.507

$18.456

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IDEA Electronic Components Group

UK . 1,548 parts In-Stock

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$22.507

100+ parts

$21.382

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$20.256

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1,548

$22.507

$21.382

$20.256

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Corohmni

South Africa . 610 parts In-Stock

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$27.578

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610

$27.578

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One Stop Electronics

USA . 1,268 parts In-Stock

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$28.000

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1,268

$28.000

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Corphita

USA . 3,097 parts In-Stock

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DigiPath Technology Company

USA . 759 parts In-Stock

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$20.292

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759

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$20.292

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Overview

Unlock the power of cutting-edge technology with the TI380FPAA by Texas Instruments. Crafted by a renowned manufacturer, this microprocessor circuit offers unparalleled quality and reliability. Ideal for a wide range of applications, this chip carrier package boasts a square shape with 52 terminals for seamless integration. With a temperature grade of commercial and a supply voltage ranging from 4.75V to 5.25V, the TI380FPAA ensures optimal performance in diverse environments. Experience the value and benefits of this innovative product, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

Surface mount technology allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures reliable operation without risk of exceeding voltage limits.

Package Shape: SQUARE

Square shape allows for efficient use of space on the circuit board, maximizing component density.

No. of Terminals: 52

High number of terminals provides ample connectivity options for various input and output configurations.

Package Style (Meter): CHIP CARRIER

Chip carrier style offers protection for the internal components and facilitates heat dissipation for reliable performance.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage allows for flexibility in power source options and compatibility with a range of applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures the product can perform reliably in a variety of environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature means the product can operate effectively in cooler environments without risk of damage.

Terminal Position: QUAD

Quad terminal position provides stability and secure connections for the product, reducing the risk of signal interference.

Maximum Seated Height: 4.57 mm

Low seated height allows for a compact design, saving space and enabling easy integration into electronic devices.

Width: 19.13 mm

Moderate width provides a balance between compact size and ease of handling during installation.

Length: 19.13 mm

Square shape and matching length provide symmetry, contributing to the overall aesthetic appeal of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that the product is suitable for standard commercial applications with consistent performance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit type offers advanced processing capabilities for efficient and high-performance operation.

Technology: CMOS

Complementary metal-oxide-semiconductor technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: J BEND

J bend terminal form allows for easy soldering and secure connections, enhancing the product's reliability and longevity.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with many existing systems and power sources.

Terminal Pitch: 1.27 mm

Narrow terminal pitch provides high-density connectivity options while maintaining signal integrity and preventing signal crosstalk.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TI380FPAA attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J52

Length:

19.13 mm

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

19.13 mm

Peripheral IC Type:

Trade Compliance

TI380FPAA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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