Loading...

TCM1532AP

Texas Instruments

TCM1532AP by Texas Instruments

Texas Instruments TCM1532AP is a Telephone Line IC with BICMOS technology. It has 8 terminals in an IN-LINE package, operating from -20°C to 70°C. Ideal for commercial applications requiring dual terminal position and through-hole mounting at a pitch of 2.54mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,360

-

-

-

-

Digiode

USA . 2,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,296

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,635 parts In-Stock

1+ parts

$13.735

100+ parts

-

1k+ parts

$14.224

10k+ parts

-

1,635

$13.735

-

$14.224

-

DigiPath Technology Company

USA . 2,316 parts In-Stock

1+ parts

$15.124

100+ parts

$13.914

1k+ parts

-

10k+ parts

-

2,316

$15.124

$13.914

-

-

IDEA Electronic Components Group

UK . 751 parts In-Stock

1+ parts

$15.433

100+ parts

$14.661

1k+ parts

$13.890

10k+ parts

-

751

$15.433

$14.661

$13.890

-

ChromeModa Solutions

Germany . 535 parts In-Stock

1+ parts

$15.433

100+ parts

$12.655

1k+ parts

-

10k+ parts

-

535

$15.433

$12.655

-

-

AZTECH Wire

Italy . 842 parts In-Stock

1+ parts

$16.688

100+ parts

-

1k+ parts

-

10k+ parts

-

842

$16.688

-

-

-

One Stop Electronics

USA . 957 parts In-Stock

1+ parts

$486.000

100+ parts

-

1k+ parts

-

10k+ parts

-

957

$486.000

-

-

-

Corphita

USA . 4,537 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,537

-

-

-

-

Overview

Enhance your telephone line applications with the TCM1532AP by Texas Instruments, a cutting-edge Telephone Line IC that guarantees superior quality and reliability. Designed by a trusted manufacturer in the industry, this product offers unmatched value and benefits to customers. With its advanced technology and commercial-grade temperature grade, the TCM1532AP is perfect for a wide range of applications, providing seamless performance and efficiency. Upgrade your telephone systems today with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to environmental factors.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board, making the product compact and suitable for tight layouts.

No. of Terminals: 8

With 8 terminals, this product provides sufficient connectivity options for various telephone line applications.

Package Style (Meter): IN-LINE

In-line package style is convenient for integration into existing systems or connections, ensuring a seamless setup process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand typical environmental conditions without overheating.

Minimum Operating Temperature: -20 °C

The product's minimum operating temperature of -20°C ensures reliable performance even in colder environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connectivity, enhancing the product's reliability and versatility.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the product is suitable for standard commercial applications, offering consistent performance in everyday use.

Technology: BICMOS

BICMOS technology combines the advantages of both Bipolar and CMOS technologies, providing high performance and low power consumption in a single package.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure soldering onto a circuit board, ensuring stable connections and signal transmission.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product is compatible with standard PCB layouts and components, simplifying the integration process.

Technical Specifications

Telephone Line ICs TCM1532AP attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20