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TCM1512BP

Texas Instruments

TCM1512BP by Texas Instruments

TCM1512BP by Texas Instruments is a Telephone Line IC with BICMOS technology. It has 8 terminals in an IN-LINE package, operating b/w -20°C to 70°C. Ideal for TELEPHONE RINGER CIRCUIT applications due to its compact size and commercial temperature grade suitability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,883 parts In-Stock

1+ parts

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4,883

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Digiode

USA . 4,840 parts In-Stock

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4,840

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ABC Electronics Ltd.

UK . 300 parts In-Stock

1+ parts

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300

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Euro-Tech

UK . 25 parts In-Stock

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25

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Resion

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 819 parts In-Stock

1+ parts

$10.156

100+ parts

-

1k+ parts

$10.696

10k+ parts

-

819

$10.156

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$10.696

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ChromeModa Solutions

Germany . 3,275 parts In-Stock

1+ parts

$11.411

100+ parts

$9.357

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3,275

$11.411

$9.357

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IDEA Electronic Components Group

UK . 2,078 parts In-Stock

1+ parts

$11.411

100+ parts

$10.840

1k+ parts

$10.270

10k+ parts

-

2,078

$11.411

$10.840

$10.270

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AZTECH Wire

Italy . 236 parts In-Stock

1+ parts

$11.810

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236

$11.810

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One Stop Electronics

USA . 250 parts In-Stock

1+ parts

$556.000

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250

$556.000

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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DigiPath Technology Company

USA . 2,136 parts In-Stock

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$10.288

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2,136

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$10.288

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A-Z Elektronik GmbH

Germany . 1,245 parts In-Stock

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1,245

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Corphita

USA . 680 parts In-Stock

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680

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Overview

Enhance your communication devices with the Texas Instruments TCM1512BP Telephone Line IC. Known for their top-notch quality and reliability, Texas Instruments offers a range of innovative solutions like this one that cater to various applications in the telecom industry. With its compact design and advanced technology, this product ensures seamless performance and enhanced functionality for your devices. Upgrade your telephone systems with the TCM1512BP today and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for electronic components.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate efficiently in various environmental conditions.

Technology: BICMOS

The BICMOS technology offers a combination of bipolar and CMOS characteristics, providing high performance and low power consumption.

Telecom IC Type: TELEPHONE RINGER CIRCUIT

Specifically designed for telephone ringer circuits, ensuring reliable and clear ringing tones in telecommunication devices.

Technical Specifications

Telephone Line ICs TCM1512BP attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Telephone Circuits

Surface Mount:

NO

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM1512BP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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