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TCM1506P

Texas Instruments

TCM1506P by Texas Instruments

Texas Instruments TCM1506P is a Telephone Line IC with BICMOS technology. It has 8 terminals in an IN-LINE package, operating from -20 to 70°C. With a low supply current of 1.3 mA, it's ideal for commercial applications requiring dual terminal positions and through-hole mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,862 parts In-Stock

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6,862

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Digiode

USA . 364 parts In-Stock

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364

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,539 parts In-Stock

1+ parts

$6.096

100+ parts

-

1k+ parts

$6.873

10k+ parts

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1,539

$6.096

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$6.873

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DigiPath Technology Company

USA . 518 parts In-Stock

1+ parts

$6.713

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-

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518

$6.713

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IDEA Electronic Components Group

UK . 573 parts In-Stock

1+ parts

$6.850

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$6.165

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573

$6.850

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$6.165

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ChromeModa Solutions

Germany . 350 parts In-Stock

1+ parts

$6.850

100+ parts

$5.617

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350

$6.850

$5.617

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AZTECH Wire

Italy . 386 parts In-Stock

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$19.652

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386

$19.652

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One Stop Electronics

USA . 1,010 parts In-Stock

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$956.000

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1,010

$956.000

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Infinite Electronics LLP (Excess)

. 937 parts In-Stock

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Corphita

USA . 806 parts In-Stock

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Overview

Enhance your communication systems with the TCM1506P by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Telephone Line ICs that provide reliable and efficient performance. With its durable plastic/epoxy package, dual terminal position, and low supply current, this product ensures seamless connectivity and optimal functionality. Whether you're looking to improve your telecommunication devices or enhance your networking capabilities, the TCM1506P offers unmatched value and benefits to meet your needs. Trust Texas Instruments for superior technology solutions that elevate your communication experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable or long-lasting applications.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options, making the product suitable for various telephone line interface configurations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperature environments without compromising its performance.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures that the product is reliable and stable in typical operating conditions, making it suitable for standard telephone line applications.

Technology: BICMOS

Utilizing BICMOS technology enables the product to combine the advantages of both bipolar and CMOS technologies, resulting in improved performance, power efficiency, and noise immunity.

Technical Specifications

Telephone Line ICs TCM1506P attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1.3 mA

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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