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TCM1506JG

Texas Instruments

TCM1506JG by Texas Instruments

TCM1506JG by Texas Instruments is a Telephone Line IC with BICMOS technology. It has 8 terminals in an IN-LINE package, operating from -20°C to 70°C. With a max supply current of 1.3 mA, it is ideal for commercial applications requiring dual terminal positions and ceramic package material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,802 parts In-Stock

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6,802

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Digiode

USA . 3,993 parts In-Stock

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3,993

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 886 parts In-Stock

1+ parts

$6.873

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886

$6.873

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Parana Technologies

USA . 1,916 parts In-Stock

1+ parts

$11.721

100+ parts

-

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$12.114

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1,916

$11.721

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$12.114

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DigiPath Technology Company

USA . 375 parts In-Stock

1+ parts

$12.907

100+ parts

$11.874

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375

$12.907

$11.874

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IDEA Electronic Components Group

UK . 1,821 parts In-Stock

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$13.170

100+ parts

$12.512

1k+ parts

$11.853

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1,821

$13.170

$12.512

$11.853

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ChromeModa Solutions

Germany . 1,709 parts In-Stock

1+ parts

$13.170

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$10.799

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1,709

$13.170

$10.799

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One Stop Electronics

USA . 603 parts In-Stock

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$761.000

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603

$761.000

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Corphita

USA . 1,902 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the TCM1506JG telephone line IC. This innovative product is designed to meet the highest standards in communication technology, providing seamless performance in a variety of applications. With its durable ceramic package and advanced BICMOS technology, this IC offers unmatched value and benefits to customers looking for superior connectivity solutions. Trust Texas Instruments for cutting-edge technology that delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and high resistance to wear and corrosion, making the product highly durable and reliable.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and compatibility with a wide range of devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stable performance even in harsh environments or under heavy usage.

Technology: BICMOS

BICMOS technology offers the benefits of both bipolar and CMOS technologies, providing a balance between speed and power consumption.

Maximum Supply Current: 1.3 mA

Low maximum supply current helps in reducing power consumption and making the product energy-efficient.

Technical Specifications

Telephone Line ICs TCM1506JG attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1.3 mA

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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