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TCM1531AP

Texas Instruments

TCM1531AP by Texas Instruments

Texas Instruments TCM1531AP is a Telephone Line IC with BICMOS technology. It has 8 terminals in an IN-LINE package, operating from -20°C to 70°C. Ideal for commercial applications requiring low supply current of 0.0013 mA and through-hole terminal form at 2.54 mm pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,688 parts In-Stock

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Vyrian

USA . 919 parts In-Stock

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919

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 839 parts In-Stock

1+ parts

$12.057

100+ parts

$1,119.660

1k+ parts

$10.851

10k+ parts

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839

$12.057

$1,119.660

$10.851

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DigiPath Technology Company

USA . 1,559 parts In-Stock

1+ parts

$13.276

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1,559

$13.276

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ChromeModa Solutions

Germany . 5,287 parts In-Stock

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$13.547

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$11.109

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5,287

$13.547

$11.109

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IDEA Electronic Components Group

UK . 2,068 parts In-Stock

1+ parts

$13.547

100+ parts

$12.870

1k+ parts

$12.192

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2,068

$13.547

$12.870

$12.192

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AZTECH Wire

Italy . 681 parts In-Stock

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$15.950

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681

$15.950

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Semicontronic

India . 1,188 parts In-Stock

1+ parts

$243.000

100+ parts

$236.925

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$235.710

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1,188

$243.000

$236.925

$235.710

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Ampacity Inc.

Singapore . 1,265 parts In-Stock

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$754.000

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1,265

$754.000

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One Stop Electronics

USA . 649 parts In-Stock

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$757.000

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649

$757.000

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Corphita

USA . 1,027 parts In-Stock

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1,027

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Corohmni

South Africa . 112 parts In-Stock

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Overview

Enhance your telecommunication systems with the TCM1531AP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. The TCM1531AP falls under the category of Telephone Line ICs, offering seamless integration for various telephone line applications. With its ceramic package body material and dual terminal position, this product ensures optimal performance even in extreme temperatures. Trust Texas Instruments to deliver innovative solutions that provide value, benefits, and unmatched advantages to customers looking to elevate their communication systems.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides durability and heat resistance, making it suitable for long-term use in various environments.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and functionalities, making the product versatile and adaptable to different applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures stable performance even in warmer conditions, increasing reliability and efficiency.

Technology: BICMOS

BICMOS technology combines the benefits of both bipolar and CMOS technologies, offering high performance, low power consumption, and faster processing speeds.

Technical Specifications

Telephone Line ICs TCM1531AP attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0013 mA

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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