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MK53732AD

STMicroelectronics

MK53732AD by STMicroelectronics

STMicroelectronics' MK53732AD is a Telephone Line IC in a small outline package with 20 terminals. Operating at -30 to 60 °C, it requires 3/5V power supply and has a crystal frequency of 3.58MHz. Ideal for telecommunications applications due to its CMOS technology and low supply current of 0.0006mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,813 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,813

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Anansix

USA . 1,584 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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1,584

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Vyrian

USA . 1,040 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,040

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 645 parts In-Stock

1+ parts

$11.481

100+ parts

-

1k+ parts

$10.333

10k+ parts

-

645

$11.481

-

$10.333

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MKK Technologies

India . 60 parts In-Stock

1+ parts

$21.589

100+ parts

-

1k+ parts

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10k+ parts

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60

$21.589

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-

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DigiPath Technology Company

USA . 60 parts In-Stock

1+ parts

$21.589

100+ parts

-

1k+ parts

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10k+ parts

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60

$21.589

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-

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Corphita

USA . 1,954 parts In-Stock

1+ parts

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100+ parts

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1,954

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-

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Parana Technologies

USA . 1,394 parts In-Stock

1+ parts

-

100+ parts

$13.727

1k+ parts

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10k+ parts

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1,394

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$13.727

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Overview

Upgrade your telephone systems with the MK53732AD from STMicroelectronics, a leading manufacturer in the industry. Designed for reliability and performance, this Telephone Line IC offers seamless connectivity and crystal-clear communication for a range of applications. With a compact package style and low power consumption, this product is the perfect solution for efficient and cost-effective telecommunication solutions. Trust STMicroelectronics to deliver high-quality components that elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving space and reducing production costs.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to handle during manufacturing and testing processes.

Power Supplies (V): 3/5

The product can operate with a wide range of voltage supplies, providing flexibility in system design.

No. of Terminals: 20

Having multiple terminals allows for connectivity to various components, enhancing the functionality of the device.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, essential for compact electronic devices.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -30 °C

The product can operate in cold temperatures as low as -30 °C, suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the overall performance of the device.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering during assembly, reducing the risk of solder bridges and other defects.

Maximum Supply Current: 0.0006 mA

The low maximum supply current helps in reducing power consumption, making the product energy-efficient.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for high-density mounting on the circuit board, enabling compact design layouts.

Crystal Frequency (MHz): 3.58

The crystal frequency of 3.58 MHz ensures stable and accurate timing for data transmission, crucial for communication devices.

Technical Specifications

Telephone Line ICs MK53732AD attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0006 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MK53732AD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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