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MK53762D

STMicroelectronics

MK53762D by STMicroelectronics

STMicroelectronics MK53762D is a Telephone Line IC with 20 terminals, operating at 3/5V. It features a small outline package, Gull Wing terminal form, and is ideal for telephone dialer circuits. With a crystal frequency of 3.58MHz, it offers commercial-grade performance in telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,235 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,235

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-

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Digiode

USA . 1,474 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,474

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Anansix

USA . 658 parts In-Stock

1+ parts

-

100+ parts

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658

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,501 parts In-Stock

1+ parts

$14.507

100+ parts

-

1k+ parts

$13.057

10k+ parts

-

1,501

$14.507

-

$13.057

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MKK Technologies

India . 909 parts In-Stock

1+ parts

$27.280

100+ parts

-

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10k+ parts

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909

$27.280

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DigiPath Technology Company

USA . 909 parts In-Stock

1+ parts

$27.280

100+ parts

-

1k+ parts

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10k+ parts

-

909

$27.280

-

-

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Parana Technologies

USA . 2,236 parts In-Stock

1+ parts

-

100+ parts

$17.346

1k+ parts

-

10k+ parts

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2,236

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$17.346

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Corphita

USA . 1,550 parts In-Stock

1+ parts

-

100+ parts

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1,550

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Overview

Upgrade your telephone systems with the MK53762D from STMicroelectronics, a leading manufacturer known for quality and reliability. This Telephone Line IC offers seamless integration and improved performance, making it ideal for various applications in the telecommunications industry. With its advanced technology and user-friendly design, this product delivers exceptional value and benefits to customers. Experience enhanced communication capabilities with the MK53762D, setting new standards in telephone line ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability of the product.

Surface Mount: YES

Being surface mountable facilitates easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Power Supplies (V): 3/5

The availability of multiple power supply options (3V and 5V) offers flexibility in design and compatibility with different systems.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for various input and output requirements in telephone line applications.

Maximum Operating Temperature: 60 °C

The high maximum operating temperature allows the product to withstand elevated environmental conditions without performance degradation.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity, enhancing the efficiency and reliability of the telephone line ICs.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electronic systems, making it compatible with a wide range of applications.

Technical Specifications

Telephone Line ICs MK53762D attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Make-break Ratio:

1:1.5

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Repertory:

REPERTORY

Maximum Seated Height:

2.65 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.6 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MK53762D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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