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MK5370N00

STMicroelectronics

MK5370N00 by STMicroelectronics

STMicroelectronics' MK5370N00 is a Telephone Line IC with 18 terminals in PLASTIC/EPOXY package. Operating at -30 to 60 °C, it requires 2.5V supply and draws 0.6mA current. Ideal for telephone line applications due to its CMOS technology and crystal frequency of 3.58MHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,554 parts In-Stock

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Anansix

USA . 895 parts In-Stock

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895

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Digiode

USA . 355 parts In-Stock

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355

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Resion

USA . 102 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 151 parts In-Stock

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$12.121

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$10.909

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$10.909

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MKK Technologies

India . 1,948 parts In-Stock

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$22.793

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DigiPath Technology Company

USA . 1,948 parts In-Stock

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$22.793

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$22.793

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Parana Technologies

USA . 1,054 parts In-Stock

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$14.492

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$14.492

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Corphita

USA . 737 parts In-Stock

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Overview

Upgrade your telephone line ICs with the MK5370N00 by STMicroelectronics. Designed with quality in mind, this product boasts high reliability and performance. With its advanced technology and durable construction, it is perfect for a wide range of applications. From enhancing communication systems to improving connectivity, this product offers unmatched value and benefits to customers. Trust STMicroelectronics to provide you with top-of-the-line solutions for all your telephone line IC needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy in the package body material ensures durability and resistance to physical damage, making the product long-lasting.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient and space-saving design integration, making it suitable for compact applications.

Power Supplies (V): 2.5

The 2.5V power supply ensures compatibility with a wide range of devices and systems, making it a versatile choice for different applications.

No. of Terminals: 18

Having 18 terminals provides ample connectivity options, allowing for versatile use in various circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy installation and connection within a circuit, simplifying the manufacturing process.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, the product can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -30 °C

The product's ability to operate at temperatures as low as -30 °C allows for use in a wide range of environmental conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish enhances solderability and conductivity, ensuring secure connections and reliable performance.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Maximum Supply Current: 0.6 mA

The low maximum supply current of 0.6mA indicates energy efficiency and minimal power consumption, making it suitable for battery-operated devices.

Nominal Supply Voltage: 2.5 V

The 2.5V nominal supply voltage ensures stable and consistent operation, resulting in reliable performance in various applications.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy PCB layout and soldering, facilitating efficient and accurate assembly.

Crystal Frequency (MHz): 3.58

The 3.58MHz crystal frequency provides precise timing and synchronization, ensuring accurate data transmission and communication.

Technical Specifications

Telephone Line ICs MK5370N00 attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e0

No. of Terminals:

18

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2.5

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.6 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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