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MK53732BD

STMicroelectronics

MK53732BD by STMicroelectronics

STMicroelectronics MK53732BD is a Telephone Line IC with 20 terminals, operating at -30 to 60 °C. It features a power supply of 3/5V, crystal frequency of 3.58MHz, and consumes only 0.0006mA. Ideal for applications requiring CMOS technology in small outline packages with surface mount capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,817 parts In-Stock

1+ parts

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100+ parts

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2,817

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Vyrian

USA . 2,708 parts In-Stock

1+ parts

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1k+ parts

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2,708

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Anansix

USA . 319 parts In-Stock

1+ parts

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319

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 884 parts In-Stock

1+ parts

$6.678

100+ parts

-

1k+ parts

$6.010

10k+ parts

-

884

$6.678

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$6.010

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MKK Technologies

India . 2,086 parts In-Stock

1+ parts

$12.558

100+ parts

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2,086

$12.558

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DigiPath Technology Company

USA . 2,086 parts In-Stock

1+ parts

$12.558

100+ parts

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2,086

$12.558

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Corphita

USA . 3,964 parts In-Stock

1+ parts

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3,964

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Parana Technologies

USA . 16 parts In-Stock

1+ parts

-

100+ parts

$7.985

1k+ parts

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10k+ parts

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16

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$7.985

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Overview

Upgrade your telephone systems with the MK53732BD from STMicroelectronics, a leading manufacturer known for top-quality products. This Telephone Line ICs category gem offers unparalleled reliability and performance, making it ideal for a wide range of applications. With its compact package style and low power consumption, this product delivers exceptional value by enhancing communication efficiency while reducing operating costs. Trust STMicroelectronics to provide you with cutting-edge technology that will take your telecommunication systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to damage, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy and efficient installation on a printed circuit board, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to work with in manufacturing and assembly processes.

Power Supplies (V): 3/5

This product can operate at both 3V and 5V, providing flexibility and compatibility with a range of systems.

No. of Terminals: 20

Having a higher number of terminals allows for more connections and functionality in the device.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the PCB and reducing overall size of the product.

Maximum Operating Temperature: 60 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without malfunctioning.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature ensures the product can work in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, ensuring secure connections and proper functioning.

Terminal Position: DUAL

Dual terminal position allows for increased stability and better electrical performance in the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall performance and efficiency.

Terminal Form: GULL WING

Gull wing terminal form is suitable for surface mount applications and provides mechanical strength to the solder joint.

Maximum Supply Current: 0.0006 mA

Low maximum supply current helps in reducing power consumption and improving energy efficiency of the product.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration with other components and reduces the risk of short circuits.

Crystal Frequency (MHz): 3.58

The specific crystal frequency of 3.58 MHz ensures accurate timing and synchronization in the device.

Technical Specifications

Telephone Line ICs MK53732BD attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0006 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MK53732BD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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