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LS256B

STMicroelectronics

LS256B by STMicroelectronics

STMicroelectronics LS256B is a Telephone Line IC with 16 terminals, operating at -45 to 70 °C. It features a supply voltage of 2.5V, max current of 0.08mA, and technology type BIPOLAR. Ideal for TELEPHONE SPEECH CIRCUIT applications due to its compact IN-LINE package style and TIN LEAD terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,661 parts In-Stock

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2,661

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Vyrian

USA . 2,654 parts In-Stock

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2,654

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Digiode

USA . 2,196 parts In-Stock

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2,196

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ComSIT Distribution GmbH

Germany . 790 parts In-Stock

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790

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Q Components

USA . 254 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 28 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 25 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 286 parts In-Stock

1+ parts

$13.500

100+ parts

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$12.150

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286

$13.500

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$12.150

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MKK Technologies

India . 1,246 parts In-Stock

1+ parts

$25.386

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1,246

$25.386

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DigiPath Technology Company

USA . 1,246 parts In-Stock

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$25.386

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1,246

$25.386

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Corphita

USA . 4,180 parts In-Stock

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4,180

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Parana Technologies

USA . 2,093 parts In-Stock

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$16.141

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2,093

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$16.141

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Kepictronics

USA . 219 parts In-Stock

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219

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Upgrade your telephone communication with the LS256B by STMicroelectronics. Crafted with precision and expertise, this Telephone Line IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures clear and seamless voice transmission. Experience enhanced performance and efficiency with the LS256B, designed to meet your telecommunications needs. Trust STMicroelectronics for superior products that deliver value and benefits to customers. Elevate your communication experience today with the LS256B.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Power Supplies (V): 3.9/12.2,2.5

The product supports multiple power supply options, giving flexibility in different operating scenarios.

No. of Terminals: 16

Having more terminals allows for more connections and functionalities in the circuit, enhancing its capabilities.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to integrate the product into existing telephone line systems without much modification.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand rigorous usage and environmental conditions.

Minimum Operating Temperature: -45 °C

The product can operate effectively even in extremely cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: TIN LEAD

The tin lead finish on the terminals ensures good conductivity and reliability in signal transmission.

Technology: BIPOLAR

Bipolar technology offers high speed and efficient performance, making the product suitable for telecommunications applications.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures stable and efficient operation of the product within the specified voltage range.

Technical Specifications

Telephone Line ICs LS256B attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.9/12.2,2.5

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.08 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LS256B Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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