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EFG7189PD

STMicroelectronics

EFG7189PD by STMicroelectronics

EFG7189PD by STMicroelectronics is a Telephone Dialer Circuit IC with 14 terminals, operating at 5V. It features CMOS technology, 3.58MHz crystal frequency, and -25 to 70 °C temperature range. Ideal for telecom applications requiring low supply current and dual terminal position in an inline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 4,145 parts In-Stock

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Digiode

USA . 3,465 parts In-Stock

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ECAB

Sweden . 2,259 parts In-Stock

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Vyrian

USA . 2,045 parts In-Stock

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Anansix

USA . 1,586 parts In-Stock

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Zilex Electronics Inc.

Canada . 993 parts In-Stock

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993

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LIBRA Elektronik GmbH

Germany . 794 parts In-Stock

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J2 Sourcing AB

Sweden . 50 parts In-Stock

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Pegasus Components GmbH

Germany . 7 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Huijzer Components

Netherlands . 1 parts In-Stock

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Native Components

USA . 651 parts In-Stock

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$0.150

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$0.144

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$0.150

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Northwest PG Solutions

USA . 1,746 parts In-Stock

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$0.165

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$0.146

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$0.165

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$0.146

IDEA Electronic Components Group

UK . 1,743 parts In-Stock

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$10.100

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$9.090

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$10.100

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MKK Technologies

India . 114 parts In-Stock

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$18.992

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$18.992

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DigiPath Technology Company

USA . 114 parts In-Stock

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$18.992

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,564 parts In-Stock

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Parana Technologies

USA . 75 parts In-Stock

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$12.076

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Assy Fe

Spain . 61 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Elevate your communication devices with the EFG7189PD by STMicroelectronics. Crafted with precision and expertise, this Telephone Line IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product ensures seamless connectivity and efficient performance. Experience the value and benefits of this innovative technology, providing customers with an unmatched user experience. Trust in STMicroelectronics to deliver cutting-edge solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the IC, ensuring it can withstand environmental factors and mechanical stress.

Power Supplies (V): 4

Low power supply requirement of 4V makes this IC energy-efficient, saving on power consumption.

Maximum Operating Temperature 70 °C

With a high maximum operating temperature of 70 °C, this IC can operate reliably in a wide range of environments without overheating.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and a wide supply voltage range, making this IC energy-efficient and reliable in communication applications.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with a wide range of systems and applications.

Technical Specifications

Telephone Line ICs EFG7189PD attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

EFG7189PD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-458-9705, 5962144589705

NIIN

144589705

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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