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TCM1501P

Texas Instruments

TCM1501P by Texas Instruments

Texas Instruments TCM1501P is a Telephone Line IC with BICMOS tech. It has 8 terminals in PLASTIC/EPOXY package, RECTANGULAR shape, IN-LINE style. Operates b/w -20 to 70 °C, drawing max 1.3 mA current. Ideal for commercial temp grade applications requiring dual terminal position at 2.54 mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,906 parts In-Stock

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3,906

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Vyrian

USA . 2,632 parts In-Stock

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2,632

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Holdelec - ElecDif-Pro

France . 13 parts In-Stock

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 800 parts In-Stock

1+ parts

$13.135

100+ parts

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800

$13.135

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Parana Technologies

USA . 1,857 parts In-Stock

1+ parts

$14.233

100+ parts

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$14.684

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1,857

$14.233

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$14.684

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ChromeModa Solutions

Germany . 6,128 parts In-Stock

1+ parts

$15.992

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$13.113

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6,128

$15.992

$13.113

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IDEA Electronic Components Group

UK . 353 parts In-Stock

1+ parts

$15.992

100+ parts

$15.192

1k+ parts

$14.393

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353

$15.992

$15.192

$14.393

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One Stop Electronics

USA . 161 parts In-Stock

1+ parts

$994.000

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161

$994.000

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Corphita

USA . 3,347 parts In-Stock

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3,347

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DigiPath Technology Company

USA . 1,410 parts In-Stock

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$14.418

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1,410

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$14.418

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Overview

Upgrade your telephone systems with the TCM1501P by Texas Instruments, a high-quality Telephone Line IC designed to enhance communication efficiency. Manufactured by industry leader Texas Instruments, this product offers exceptional reliability and performance. Ideal for a wide range of applications, this IC provides seamless transmission on telephone lines. Experience improved connectivity and clear audio signals with the TCM1501P, delivering unmatched value and benefits to customers looking to optimize their telecommunications systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the product long-lasting and affordable.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting various components, allowing for versatile usage.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand heat without compromising performance.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, ensuring efficiency and reliability.

Maximum Supply Current: 1.3 mA

Low maximum supply current helps conserve energy and prolong battery life.

Technical Specifications

Telephone Line ICs TCM1501P attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1.3 mA

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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