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TCM1512JG

Texas Instruments

TCM1512JG by Texas Instruments

TCM1512JG by Texas Instruments is a Telephone Line IC with BICMOS technology. It has 8 terminals in an IN-LINE package style, operating from -20°C to 70°C. The ceramic package is rectangular, suitable for commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,487 parts In-Stock

1+ parts

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8,487

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Digiode

USA . 3,029 parts In-Stock

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3,029

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 443 parts In-Stock

1+ parts

$7.695

100+ parts

$714.592

1k+ parts

$6.925

10k+ parts

-

443

$7.695

$714.592

$6.925

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DigiPath Technology Company

USA . 2,158 parts In-Stock

1+ parts

$8.473

100+ parts

$7.795

1k+ parts

-

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2,158

$8.473

$7.795

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IDEA Electronic Components Group

UK . 1,675 parts In-Stock

1+ parts

$8.646

100+ parts

$8.214

1k+ parts

$7.781

10k+ parts

-

1,675

$8.646

$8.214

$7.781

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ChromeModa Solutions

Germany . 952 parts In-Stock

1+ parts

$8.646

100+ parts

$7.090

1k+ parts

-

10k+ parts

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952

$8.646

$7.090

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AZTECH Wire

Italy . 711 parts In-Stock

1+ parts

$13.198

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711

$13.198

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One Stop Electronics

USA . 183 parts In-Stock

1+ parts

$174.000

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183

$174.000

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Corphita

USA . 3,127 parts In-Stock

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3,127

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Overview

Experience superior quality and reliability with the TCM1512JG by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments provides cutting-edge solutions for Telephone Line ICs, guaranteeing top-notch performance and seamless integration. This product offers unmatched value and benefits, catering to a wide range of applications and delivering exceptional results. Trust Texas Instruments to deliver excellence with the TCM1512JG.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and excellent electrical insulation properties, making it a suitable choice for components that may generate heat or require protection from electrical interference.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of board space and easy placement on PCBs, making the product compact and easy to integrate into various applications.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for more functionality to be incorporated into the device.

Package Style (Meter): IN-LINE

In-line package style makes it easy to connect the device in a linear fashion, facilitating a neat and organized setup.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand moderate heat conditions, ensuring reliable performance in various environments.

Minimum Operating Temperature: -20 °C

Capable of operating at temperatures as low as -20°C, making it suitable for use in diverse climates and conditions.

Terminal Position: DUAL

Dual terminal position allows for increased signal transmission and reliability, offering redundancy in connections for enhanced performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable operation in standard room temperature environments, making it suitable for most commercial applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption, making the product efficient and reliable.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and easy soldering, ensuring secure connections and reliability in harsh operating conditions.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54mm allows for standard spacing between terminals, facilitating easy assembly and compatibility with standard PCB designs.

Technical Specifications

Telephone Line ICs TCM1512JG attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T8

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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