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TCM1520AD

Texas Instruments

TCM1520AD by Texas Instruments

TCM1520AD by Texas Instruments is a Telephone Line IC with BICMOS technology. It operates b/w -40 to 85°C, with power supplies of 40/150V and max supply current of 0.0016mA. This TELEPHONE RINGER CIRCUIT has 8 terminals in a small outline package for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,717 parts In-Stock

1+ parts

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100+ parts

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6,717

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Digiode

USA . 1,213 parts In-Stock

1+ parts

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1,213

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Florida Circuit

USA . 182 parts In-Stock

1+ parts

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182

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,076 parts In-Stock

1+ parts

$6.642

100+ parts

-

1k+ parts

$7.359

10k+ parts

-

2,076

$6.642

-

$7.359

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DigiPath Technology Company

USA . 1,860 parts In-Stock

1+ parts

$7.314

100+ parts

-

1k+ parts

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10k+ parts

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1,860

$7.314

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ChromeModa Solutions

Germany . 4,020 parts In-Stock

1+ parts

$7.463

100+ parts

$6.120

1k+ parts

-

10k+ parts

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4,020

$7.463

$6.120

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IDEA Electronic Components Group

UK . 185 parts In-Stock

1+ parts

$7.463

100+ parts

-

1k+ parts

$6.717

10k+ parts

-

185

$7.463

-

$6.717

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AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$16.765

100+ parts

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883

$16.765

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One Stop Electronics

USA . 1,485 parts In-Stock

1+ parts

$623.000

100+ parts

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1,485

$623.000

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Corphita

USA . 4,573 parts In-Stock

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4,573

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Overview

Enhance the performance of your telephone line systems with the TCM1520AD by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Telephone Line ICs that offer unmatched reliability and functionality. Ideal for various applications, this product ensures seamless communication while providing exceptional value and benefits to customers. Upgrade your telecom systems today with the TCM1520AD and experience the advantages it brings to your business operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, making it ideal for portable devices.

Surface Mount: YES

Surface-mount technology allows for easy and efficient assembly, making the product suitable for automated manufacturing processes.

Power Supplies (V): 40/150

The wide range of power supply options (40V to 150V) provides flexibility in designing and implementing the product in various applications.

No. of Terminals: 8

Having 8 terminals allows for more connectivity options and functionality in the product design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact device designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand higher temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The product can operate in cold temperatures as low as -40°C, making it suitable for a wide range of operating conditions.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connecting the product, enhancing its reliability.

Temperature Grade: INDUSTRIAL

Designed for industrial use, the product meets the required standards and specifications for reliable performance in harsh environments.

Technology: BICMOS

The use of BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form provides improved solder joint reliability, making the product suitable for applications requiring robust connections.

Maximum Supply Current: 0.0016 mA

The low maximum supply current consumption makes the product energy-efficient, ideal for battery-powered or low-power applications.

Telecom IC Type: TELEPHONE RINGER CIRCUIT

Specifically designed for telephone ringer circuit applications, the product offers optimized performance and functionality in telecommunications devices.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and reliable connections, ensuring proper signal transmission and functionality in the product.

Technical Specifications

Telephone Line ICs TCM1520AD attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

40/150

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0016 mA

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TCM1520AD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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