Loading...

PCD3310TD

NXP Semiconductors

PCD3310TD by NXP Semiconductors

PCD3310TD by NXP Semiconductors is a compact telephone dialer circuit IC designed for surface mount applications. It operates at a nominal voltage of 3V, with a max current of 0.2mA and supports temperatures from -25 °C to 70 °C. Ideal for telecom devices, it features a small outline package with 28 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,095

-

-

-

-

Digiode

USA . 1,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,458

-

-

-

-

Vyrian

USA . 143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

143

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 567 parts In-Stock

1+ parts

$214.000

100+ parts

-

1k+ parts

-

10k+ parts

-

567

$214.000

-

-

-

UNI Independent Distributors

Spain . 969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

969

-

-

-

-

Corphita

USA . 872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

872

-

-

-

-

Overview

Elevate your communication solutions with the PCD3310TD from NXP Semiconductors, a trusted leader in innovation. This compact, high-quality Telephone Line IC is designed to enhance dialing efficiency while ensuring reliability in diverse applications. Its robust performance across varying temperatures guarantees longevity and stability, making it ideal for modern telecommunication devices. Choose PCD3310TD for exceptional value, seamless integration, and peace of mind in every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity of the Telephone Line IC, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic circuits, enhancing overall efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, allowing for better layout and design flexibility.

No. of Terminals: 28

With 28 terminals, this IC supports multiple connections, enhancing functionality and enabling complex applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style provides a size-efficient solution for compact electronic devices, vital for modern telecommunications.

Maximum Operating Temperature: 70 °C

The ability to operate at a maximum temperature of 70 °C ensures reliability in diverse environmental conditions.

Minimum Operating Temperature: -25 °C

This IC can function in low-temperature environments, making it suitable for applications in various climates.

Terminal Position: DUAL

Dual terminal positioning allows for versatile connections, making integration easier with existing circuit designs.

Maximum Seated Height: 2.65 mm

A low maximum seated height improves compatibility with compact designs, ensuring a snug fit on various PCBs.

Width: 7.5 mm

This width size is optimal for space-saving designs, making it a practical choice for small-scale applications.

Length: 17.9 mm

The length of 17.9 mm contributes to a compact overall design, suitable for applications where space is at a premium.

Terminal Form: GULL WING

Gull wing terminals promote easy soldering and reliable connections, enhancing the overall assembly process.

Maximum Supply Current: 0.2 mA

Low supply current helps in energy-efficient designs, prolonging battery life in portable devices.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

Specialized as a telephone dialer circuit, this IC is purpose-built for telecommunications, ensuring optimal performance.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V, this IC is compatible with a wide range of low-power applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch facilitates easier soldering and connection to PCB traces, aiding in overall assembly efficiency.

Make-break Ratio: 1:2

The make-break ratio of 1:2 indicates effective signal control, essential for reliable dialing operations.

Technical Specifications

Telephone Line ICs PCD3310TD attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

Length:

17.9 mm

Make-break Ratio:

1:2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

PCD3310TD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20