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PCD3310EP

NXP Semiconductors

PCD3310EP by NXP Semiconductors

PCD3310EP by NXP Semiconductors is a telephone dialer circuit IC designed for efficient telecom applications. It operates at a nominal voltage of 3V, with a max current of 0.2mA and supports temperatures from -25 °C to 70 °C. Its compact design features 20 through-hole terminals in a rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,555 parts In-Stock

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3,555

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Vyrian

USA . 3,312 parts In-Stock

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3,312

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Anansix

USA . 734 parts In-Stock

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734

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One Stop Electronics

USA . 1,380 parts In-Stock

1+ parts

$154.000

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1,380

$154.000

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UNI Independent Distributors

Spain . 7,435 parts In-Stock

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7,435

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Corphita

USA . 1,275 parts In-Stock

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Overview

Elevate your telecommunications with the PCD3310EP from NXP Semiconductors, a trusted leader in innovation. This versatile telephone line IC is designed for optimal performance, delivering reliability and efficiency that can enhance any communication system. Its robust design allows for seamless integration into diverse applications, ensuring crisp audio quality and minimal power consumption. Experience superior value and peace of mind with NXP's commitment to excellence—your ideal choice for modern connectivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and insulation, making the product suitable for various environmental conditions.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting and integration into electronic circuits, optimizing space utilization.

No. of Terminals: 20

With 20 terminals, the product provides ample connection points for multiple applications, ensuring versatile connectivity.

Package Style (Meter): IN-LINE

The in-line package style allows for straightforward assembly with minimal footprint, making it ideal for compact designs.

Maximum Operating Temperature: 70 °C

A maximum temperature rating of 70 °C ensures reliable performance in various operating conditions without risk of failure.

Minimum Operating Temperature: -25 °C

The ability to function effectively at -25 °C makes this IC suitable for use in colder climates and harsh environments.

Terminal Position: DUAL

Dual terminal positioning enhances stability and ensures secure connections in circuit designs.

Maximum Seated Height: 4.2 mm

A low seated height of 4.2 mm supports applications where space is a constraint, allowing for more compact designs.

Width: 7.62 mm

The 7.62 mm width contributes to streamlined layouts, enabling efficient board design and optimized assembly.

Length: 26.73 mm

A length of 26.73 mm provides a balance between size and functionality, making it compatible with standard PCB layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust mechanical support and are suitable for high-strength applications.

Maximum Supply Current: 0.2 mA

A low maximum supply current of 0.2 mA promotes energy efficiency, making it ideal for battery-operated devices.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

Designed specifically as a telephone dialer circuit, this IC simplifies integration into telecommunication systems.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V ensures compatibility with a wide range of modern digital circuits and battery systems.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is standard for many applications, facilitating easy integration with existing circuit designs.

Make-break Ratio: 1:2

The favorable make-break ratio of 1:2 enhances dialing efficiency and responsiveness, crucial for telecommunications applications.

Technical Specifications

Telephone Line ICs PCD3310EP attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

Make-break Ratio:

1:2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PCD3310EP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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