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PCD3310GP

NXP Semiconductors

PCD3310GP by NXP Semiconductors

PCD3310GP by NXP Semiconductors is a telephone dialer circuit IC designed for efficient telecom applications. It operates at a nominal voltage of 3V, with a max supply current of 0.2mA and supports temperatures from -25 °C to 70 °C. Its compact design features 20 through-hole terminals in a rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,546 parts In-Stock

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Anansix

USA . 2,069 parts In-Stock

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Vyrian

USA . 797 parts In-Stock

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797

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One Stop Electronics

USA . 195 parts In-Stock

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$139.000

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195

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Corphita

USA . 4,163 parts In-Stock

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UNI Independent Distributors

Spain . 2,557 parts In-Stock

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Overview

Elevate your communication solutions with the PCD3310GP from NXP Semiconductors—a trusted name in innovation. This Telephone Line IC combines reliability and exceptional performance, making it perfect for a wide range of applications, from home phones to sophisticated telecom systems. Experience unmatched durability across temperatures, advanced dialing capabilities, and low power consumption, ensuring you get both quality and efficiency for your projects. Choose NXP for technology that empowers your connectivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making this product reliable in various conditions.

Package Shape: RECTANGULAR

A rectangular shape allows for efficient space utilization on circuit boards, enabling more compact designs.

No. of Terminals: 20

Having 20 terminals provides versatile connectivity options, supporting various configuration needs in telephone line applications.

Package Style (Meter): IN-LINE

An in-line package style simplifies integration into existing systems, facilitating straightforward assembly and soldering.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can function well in moderately warm environments, ensuring reliable performance.

Minimum Operating Temperature: -25 °C

The ability to operate down to -25 °C makes this IC suitable for use in colder climates, extending its application range.

Terminal Position: DUAL

Dual terminal positioning allows for simplified layout and better routing options on printed circuit boards.

Maximum Seated Height: 4.2 mm

A maximum seated height of 4.2 mm helps in keeping the overall profile of the circuit low, beneficial for compact devices.

Width: 7.62 mm

This width makes it suitable for high-density boards where space is at a premium without sacrificing performance.

Length: 26.73 mm

The length provides ample space for connections, contributing to ease of integration while maintaining a compact footprint.

Terminal Form: THROUGH-HOLE

Through-hole terminals enable secure connections and are generally easier to handle during assembly, making the product user-friendly.

Maximum Supply Current: 0.2 mA

A low maximum supply current of 0.2 mA ensures energy efficiency, making it suitable for battery-operated devices.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

As a telephone dialer circuit, this IC is specifically designed for its intended application, providing targeted performance and reliability.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V allows for compatibility with standard low-voltage power supplies, enhancing design flexibility.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is commonly used, making it compatible with a wide range of connectors and reducing design complexities.

Make-break Ratio: 1:2

The make-break ratio of 1:2 ensures efficient signaling, optimizing the performance of the dialing functionality.

Technical Specifications

Telephone Line ICs PCD3310GP attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

Make-break Ratio:

1:2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PCD3310GP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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