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PCD3310APN

NXP Semiconductors

PCD3310APN by NXP Semiconductors

PCD3310APN by NXP Semiconductors is a telephone dialer circuit IC designed for efficient telecom applications. It operates at a nominal voltage of 3V, with a max supply current of 0.2mA and supports temperatures from -25 °C to 70 °C. Its compact design features 20 through-hole terminals in a rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,976 parts In-Stock

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3,976

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Digiode

USA . 1,715 parts In-Stock

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1,715

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Anansix

USA . 559 parts In-Stock

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559

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 434 parts In-Stock

1+ parts

$931.000

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434

$931.000

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Corphita

USA . 4,509 parts In-Stock

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4,509

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UNI Independent Distributors

Spain . 3,980 parts In-Stock

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3,980

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Overview

Elevate your communication systems with the PCD3310APN from NXP Semiconductors, a trusted leader in innovation. This advanced telephone line IC combines reliability and efficiency, ensuring seamless connectivity in various applications. Designed for optimal performance under diverse conditions, it enhances dialing precision while maintaining low power consumption. Experience superior build quality and unmatched support from a renowned manufacturer, making the PCD3310APN the smart choice for modern telecom solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for long-term use in various applications.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and facilitates easy integration into circuit boards, optimizing board layout and reducing overall size.

No. of Terminals: 20

With 20 terminals, this IC offers sufficient connectivity options, allowing for versatile designs and accommodating various functionalities in telephone applications.

Package Style (Meter): IN-LINE

An in-line package style simplifies the installation process in through-hole manufacturing, making it a convenient choice for manufacturers.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures reliable performance in environments that experience varying temperatures, enhancing product reliability.

Minimum Operating Temperature: -25 °C

With a minimum operating temperature of -25 °C, this IC can function effectively in colder climates, providing versatility for outdoor and extreme applications.

Terminal Position: DUAL

Dual terminal positioning enhances design flexibility and facilitates easier routing on printed circuit boards, optimizing electrical performance.

Maximum Seated Height: 4.2 mm

A maximum seated height of 4.2 mm allows for compact designs, making this IC suitable for space-constrained applications without sacrificing functionality.

Width: 7.62 mm

The width of 7.62 mm is ideal for fitting into standard layouts, enabling seamless compatibility with other electronic components.

Length: 26.73 mm

At a length of 26.73 mm, this IC strikes a good balance between size and functionality, ensuring ease of use in various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides enhanced mechanical stability and is advantageous for automated manufacturing processes.

Maximum Supply Current: 0.2 mA

With a maximum supply current of only 0.2 mA, this IC is power-efficient, making it ideal for battery-operated devices and reducing overall energy consumption.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

As a dedicated telephone dialer circuit, this IC is specifically designed for efficient dialing operations, ensuring reliability and performance in telecom applications.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V allows for compatibility with low-voltage systems, promoting energy efficiency and safe operation in various applications.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard for many electronic components, ensuring easy integration and availability of related components.

Make-break Ratio: 1:1.5

A make-break ratio of 1:1.5 indicates balanced performance in switching applications, providing reliable operation in dialing functionality.

Technical Specifications

Telephone Line ICs PCD3310APN attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

Make-break Ratio:

1:1.5

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PCD3310APN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-307-2583, 5962013072583

NIIN

013072583

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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