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PCD3310PN

NXP Semiconductors

PCD3310PN by NXP Semiconductors

PCD3310PN by NXP Semiconductors is a telephone dialer circuit IC designed for efficient telecom applications. It operates at a nominal voltage of 3V, with a max supply current of 0.2mA and supports temperatures from -25 °C to 70 °C. Its compact design features 20 terminals in an in-line package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,536 parts In-Stock

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1,536

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Digiode

USA . 1,282 parts In-Stock

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Anansix

USA . 310 parts In-Stock

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310

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One Stop Electronics

USA . 579 parts In-Stock

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$592.000

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579

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UNI Independent Distributors

Spain . 4,175 parts In-Stock

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Corphita

USA . 1,384 parts In-Stock

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Overview

Experience unparalleled reliability and quality with the PCD3310PN from NXP Semiconductors, a leader in innovative technology. This versatile telephone line IC offers exceptional performance in various applications, enhancing communication systems with its robust design. With NXP's commitment to excellence, customers benefit from unmatched durability and efficiency, ensuring seamless integration into your projects. Elevate your telecommunications with a trusted partner!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on circuit boards, facilitating easier integration in designs.

No. of Terminals: 20

With 20 terminals, this IC allows for multiple connections, enhancing its versatility and functionality in various telecommunications setups.

Package Style (Meter): IN-LINE

The in-line package style ensures straightforward integration into systems and aids in efficient assembly processes.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability in demanding environments without compromising performance.

Minimum Operating Temperature: -25 °C

Ability to function in low temperatures expands the potential application range of this IC, making it suitable for diverse climates.

Terminal Position: DUAL

The dual terminal position provides flexibility in layout design, making it easier to accommodate in compact spaces.

Maximum Seated Height: 4.2 mm

A lower seated height aids in minimizing space requirements on printed circuit boards, allowing for more compact designs.

Width: 7.62 mm

This width strikes a balance between compact design and sufficient room for terminal soldering, enhancing usability.

Length: 26.73 mm

The length of the IC provides ample space for connections while still maintaining a compact form factor.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure a secure mechanical and electrical connection, contributing to overall circuit reliability.

Maximum Supply Current: 0.2 mA

Low supply current results in energy-efficient operation, making it a cost-effective choice for battery-powered devices.

Telecom IC Type: TELEPHONE DIALER CIRCUIT

As a dedicated telephone dialer circuit, it provides optimized functionality specifically designed for telecommunication applications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V allows compatibility with standard power sources while ensuring low power consumption.

Terminal Pitch: 2.54 mm

The standard 2.54 mm terminal pitch fits well with common PCB layouts, simplifying design and installation.

Make-break Ratio: 1:2

This ratio optimizes the dialing functionality, enhancing performance in real-time communication applications.

Technical Specifications

Telephone Line ICs PCD3310PN attributes and parameters. Explore more Telephone Line ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

Make-break Ratio:

1:2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

.2 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

PCD3310PN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-307-2583, 5962013072583

NIIN

013072583

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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