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E-LS1240AD1

STMicroelectronics

E-LS1240AD1 by STMicroelectronics

E-LS1240AD1 by STMicroelectronics is a telephone ringer circuit IC designed for surface mount applications. It operates at a nominal voltage of 26V, with a max temp of 70 °C and features an 8-terminal gull-wing package. Ideal for telecom systems, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,079 parts In-Stock

1+ parts

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2,079

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Digiode

USA . 1,370 parts In-Stock

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1,370

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Anansix

USA . 87 parts In-Stock

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87

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 541 parts In-Stock

1+ parts

$0.126

100+ parts

-

1k+ parts

-

10k+ parts

$0.121

541

$0.126

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$0.121

Northwest PG Solutions

USA . 174 parts In-Stock

1+ parts

$0.138

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$0.122

174

$0.138

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$0.122

IDEA Electronic Components Group

UK . 197 parts In-Stock

1+ parts

$7.917

100+ parts

-

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$7.125

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197

$7.917

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$7.125

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MKK Technologies

India . 1,758 parts In-Stock

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$14.887

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1,758

$14.887

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DigiPath Technology Company

USA . 1,758 parts In-Stock

1+ parts

$14.887

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1,758

$14.887

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Corphita

USA . 3,326 parts In-Stock

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3,326

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Parana Technologies

USA . 832 parts In-Stock

1+ parts

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$9.466

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832

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$9.466

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Overview

Unlock the potential of your telecom designs with the E-LS1240AD1 from STMicroelectronics. This high-quality Telephone Line IC stands out for its reliability and performance, ensuring seamless integration in various applications like telephone ringer circuits. With STMicroelectronics' renowned expertise, you can trust in superior durability and efficiency. Elevate your projects today—experience exceptional value and peace of mind with a product designed to meet the demands of modern communication systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making this product reliable in various applications.

Surface Mount: YES

Being surface mount allows for a compact design and easier integration into modern electronic boards, ensuring space efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout arrangements, facilitating effective placement on PCB layouts.

Power Supplies (V): 26

With a maximum power supply of 26V, this IC is ideal for applications requiring higher voltage without compromising performance.

No. of Terminals: 8

The 8 terminals provide flexibility in circuit design, allowing for various configurations and functionalities in your telephone line applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a reduced footprint, making it suitable for compact devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures that the IC can function reliably even in warmer environments, enhancing its usability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is designed to perform in extreme cold conditions, making it versatile for various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold for terminal finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in PCB layout and ensures compatibility with a variety of mounting designs.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm minimizes the overall profile of the device, making it ideal for low-profile applications.

Width: 3.9 mm

A compact width of 3.9 mm ensures that the IC can fit into tight spaces on circuit boards without compromising other component placements.

Length: 4.9 mm

The length of 4.9 mm contributes to the overall small form factor of this IC, making it suitable for space-constrained designs.

Terminal Form: GULL WING

Gull wing terminal form enhances solderability and provides mechanical stability, making assembly easier and more reliable.

Telecom IC Type: TELEPHONE RINGER CIRCUIT

Designed specifically as a telephone ringer circuit, this IC is tailored to meet the demands of reliable ringing performance in telecommunication systems.

Nominal Supply Voltage: 26 V

With a nominal supply voltage of 26V, this IC can efficiently operate in telecom systems designed for this voltage, ensuring optimal performance.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy routing on PCB layouts and compatibility with common SMT processes, enhancing design efficiency.

Technical Specifications

Telephone Line ICs E-LS1240AD1 attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

26

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

26 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

E-LS1240AD1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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