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LS1240

STMicroelectronics

LS1240 by STMicroelectronics

STMicroelectronics LS1240 is a Telephone Line IC with 8 terminals, operating at 26V. It features PLASTIC/EPOXY package, -20 to 70 °C temp range, and THROUGH-HOLE terminal form. Ideal for TELEPHONE RINGER CIRCUIT applications due to its commercial temperature grade and rectangular package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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ComSIT Distribution GmbH

Germany . 11,253 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3,800 parts In-Stock

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Anansix

USA . 2,643 parts In-Stock

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Vyrian

USA . 2,380 parts In-Stock

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Digiode

USA . 2,194 parts In-Stock

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Goldney Electronics S.L.

Spain . 764 parts In-Stock

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Speed Components Ltd

Israel . 372 parts In-Stock

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372

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ABC Electronics Ltd.

UK . 260 parts In-Stock

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260

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ECAB

Sweden . 120 parts In-Stock

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120

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LittleDiode

UK . 93 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 63 parts In-Stock

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J2 Sourcing AB

Sweden . 50 parts In-Stock

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Inland Empire Components Inc.

USA . 27 parts In-Stock

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Q Components

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IDEA Electronic Components Group

UK . 1,565 parts In-Stock

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$15.891

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$14.302

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MKK Technologies

India . 1,445 parts In-Stock

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$29.882

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$29.882

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DigiPath Technology Company

USA . 1,445 parts In-Stock

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$29.882

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 3,295 parts In-Stock

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Parana Technologies

USA . 1,193 parts In-Stock

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$19.000

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Assy Fe

Spain . 1,140 parts In-Stock

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Kepictronics

USA . 491 parts In-Stock

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491

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Infinite Electronics LLP (Excess)

. 157 parts In-Stock

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Overview

Upgrade your telephone line circuits with the LS1240 by STMicroelectronics. Manufactured by a trusted industry leader, this high-quality IC offers reliable performance and durability. Ideal for telephone ringer circuits, this product provides seamless communication experience. With a wide range of applications and commercial-grade temperature tolerance, the LS1240 delivers exceptional value and benefits to customers looking for top-notch telecom solutions. Experience the difference with STMicroelectronics today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for long-term use.

Power Supplies (V): 26

The product operates at a power supply of 26V, making it compatible with standard telephone systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing telephone line systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product ensures reliable performance even in high-temperature environments.

Nominal Supply Voltage: 26 V

The nominal supply voltage of 26V ensures compatibility with standard telephone line voltages, making it a reliable choice for telephone applications.

Technical Specifications

Telephone Line ICs LS1240 attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

26

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Telephone Circuits

Nominal Supply Voltage:

26 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LS1240 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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