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LS1240D1

STMicroelectronics

LS1240D1 by STMicroelectronics

LS1240D1 by STMicroelectronics is a Telephone Line IC with 8 terminals, operating at -20 to 70 °C. It has a supply voltage of 26V and max current of 1.8mA. This small outline package is ideal for telecom applications requiring surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,997 parts In-Stock

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3,997

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Vyrian

USA . 2,338 parts In-Stock

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2,338

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Anansix

USA . 1,902 parts In-Stock

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1,902

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 152 parts In-Stock

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152

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,569 parts In-Stock

1+ parts

$6.489

100+ parts

-

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$5.840

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1,569

$6.489

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$5.840

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MKK Technologies

India . 153 parts In-Stock

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$12.202

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153

$12.202

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DigiPath Technology Company

USA . 153 parts In-Stock

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$12.202

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153

$12.202

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Parana Technologies

USA . 1,691 parts In-Stock

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$7.758

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1,691

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$7.758

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Corphita

USA . 1,260 parts In-Stock

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Overview

Enhance your telecommunications systems with the LS1240D1 by STMicroelectronics, a leading manufacturer known for superior quality and reliability. Designed for telephone line applications, this innovative IC offers exceptional value and benefits to customers seeking efficient and high-performance solutions. With advanced features and a durable plastic/epoxy package, the LS1240D1 is ideal for a wide range of commercial and industrial applications. Upgrade your communication infrastructure today with the LS1240D1 and experience the advantages of cutting-edge technology from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the IC, ensuring longer lifespan and reliability.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and simplifying assembly process.

Power Supplies (V): 26

Suitable for applications requiring a power supply of 26V, ensuring compatibility with a variety of telephone line systems.

No. of Terminals: 8

8 terminals provide ample connectivity options for various external components, enhancing functionality and versatility.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can withstand high temperature environments, ensuring stable performance in harsh conditions.

Minimum Operating Temperature: -20 °C

Designed to operate in temperatures as low as -20 °C, making it suitable for use in cold environments without compromising performance.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity, ensuring secure connections for reliable operation.

Terminal Position: DUAL

Dual terminal position allows for flexible installation and connection options, accommodating different circuit layouts and configurations.

Maximum Supply Current: 1.8 mA

Low supply current of 1.8 mA minimizes power consumption, making the IC energy-efficient and cost-effective to operate.

Nominal Supply Voltage: 26 V

Nominal supply voltage of 26V provides stable power delivery to the IC, ensuring consistent performance and functionality.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm allows for precise and compact placement of components on the circuit board, facilitating efficient assembly and layout design.

Technical Specifications

Telephone Line ICs LS1240D1 attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

26

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1.8 mA

Nominal Supply Voltage:

26 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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