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LS1240AD1013TR

STMicroelectronics

LS1240AD1013TR by STMicroelectronics

LS1240AD1013TR by STMicroelectronics is a Telephone Line IC with 8 terminals in a small outline package. It operates b/w -40°C to 70°C, featuring Gull Wing terminals and Tin Lead finish. Ideal for telephone ringer circuits due to its compact size and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 1,923 parts In-Stock

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Digiode

USA . 1,335 parts In-Stock

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Vyrian

USA . 770 parts In-Stock

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770

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Nova Conductors

Japan . 55 parts In-Stock

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55

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IDEA Electronic Components Group

UK . 1,292 parts In-Stock

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$6.823

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$6.140

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$6.823

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$6.140

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MKK Technologies

India . 1,034 parts In-Stock

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$12.830

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$12.830

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DigiPath Technology Company

USA . 1,034 parts In-Stock

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$12.830

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$12.830

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AZTECH Wire

Italy . 645 parts In-Stock

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$17.344

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645

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Ampacity Inc.

Singapore . 971 parts In-Stock

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$257.000

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971

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,913 parts In-Stock

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RC Electronics

USA . 4,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,942 parts In-Stock

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Continental Prestige Electronics

USA . 3,868 parts In-Stock

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Corphita

USA . 2,973 parts In-Stock

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Kepictronics

USA . 2,306 parts In-Stock

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Metaverse IC Inc.

Canada . 1,788 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Parana Technologies

USA . 519 parts In-Stock

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$8.158

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Argo Parts USA

USA . 179 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Upgrade your telephone line ICs with the LS1240AD1013TR from STMicroelectronics. With a reputation for high-quality manufacturing, STMicroelectronics delivers reliable products that excel in performance and durability. Designed for telecom applications, this telephone ringer circuit offers exceptional value to customers by providing seamless connectivity and advanced functionality. Trust STMicroelectronics to power your communication systems with cutting-edge technology and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-lasting performance.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

Facilitates uniform and compact placement on the circuit board, optimizing space utilization.

No. of Terminals: 8

Sufficient number of terminals for connecting to other components, allowing for versatile integration into various telephone line applications.

Package Style (Meter): SMALL OUTLINE

Suitable for applications where space is limited, such as in portable electronic devices.

Maximum Operating Temperature: 70 °C

Ensures reliable operation even in high-temperature environments, enhancing the overall performance and longevity of the IC.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures, making it suitable for use in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Provides a reliable electrical connection and resistance to corrosion, ensuring stable and consistent performance.

Terminal Position: DUAL

Allows for more flexible PCB layout options and easier PCB routing, contributing to a more efficient design.

Maximum Seated Height: 1.75 mm

Low profile design for compact applications, enhancing the overall aesthetics and functionality of the product.

Width: 3.9 mm

Compact width for efficient use of space on the circuit board, particularly important in densely populated PCB designs.

Length: 4.9 mm

Optimal length for accommodating the necessary components and connections without taking up excessive space.

Terminal Form: GULL WING

Facilitates easier soldering during PCB assembly, ensuring reliable electrical connections and overall product performance.

Telecom IC Type: TELEPHONE RINGER CIRCUIT

Specifically designed for telephone line applications, ensuring compatibility and reliable performance in such environments.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into various PCB designs, enabling compatibility with common manufacturing processes.

Technical Specifications

Telephone Line ICs LS1240AD1013TR attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

LS1240AD1013TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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