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M3561B

STMicroelectronics

M3561B by STMicroelectronics

STMicroelectronics' M3561B is a CMOS Telephone Line IC with 18 terminals in an IN-LINE package. It operates b/w -25 °C to 70°C, powered by 1.5-5.5V supplies, drawing max 0.5mA current. Ideal for telecommunication applications requiring PLASTIC/EPOXY package and Tin/Lead terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 8,253 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,911 parts In-Stock

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Digiode

USA . 4,428 parts In-Stock

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Anansix

USA . 2,159 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 512 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

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$7.208

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$6.487

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2,317

$7.208

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$6.487

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AZTECH Wire

Italy . 682 parts In-Stock

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$9.480

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$9.480

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MKK Technologies

India . 803 parts In-Stock

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$13.555

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$13.555

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DigiPath Technology Company

USA . 803 parts In-Stock

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$13.555

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Corphita

USA . 4,792 parts In-Stock

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Parana Technologies

USA . 630 parts In-Stock

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$8.618

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Perfect Parts

USA . 535 parts In-Stock

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Assy Fe

Spain . 512 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 239 parts In-Stock

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Overview

Elevate your communication devices with the M3561B by STMicroelectronics, a top-tier Telephone Line IC that promises unparalleled quality and reliability. Crafted by a renowned manufacturer in the industry, this product offers a seamless blend of innovation and functionality, making it ideal for a wide range of applications. Its advanced technology and user-friendly design ensure effortless integration and superior performance, while its affordable price point delivers unbeatable value to customers. Upgrade your projects with the M3561B and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Epoxy material provides durability and protection to the components inside the package, ensuring long-term reliability.

Power Supplies (V): 1.5/5.5

Wide range of power supply options allows for flexibility in different operating environments.

No. of Terminals: 18

Sufficient number of terminals for connecting various components and peripherals.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in demanding conditions.

Minimum Operating Temperature: -25 °C

Low minimum operating temperature allows for operation in cold environments without performance degradation.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead finish on terminals provides good conductivity and solderability for easy installation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient operation.

Maximum Supply Current: 0.5 mA

Low supply current ensures energy efficiency and extends battery life in portable applications.

Technical Specifications

Telephone Line ICs M3561B attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e0

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

1.5/5.5

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.5 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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