Loading...

TCM1531P

Texas Instruments

TCM1531P by Texas Instruments

TCM1531P by Texas Instruments is a Telephone Line IC with BICMOS technology. It features 8 terminals in an IN-LINE package style, operating b/w -20°C to 70°C. Ideal for TELEPHONE RINGER CIRCUIT applications due to its low supply current of 0.0013 mA and compact dimensions of 7.62mm x 9.81mm x 5.08mm.

Median Price

$1.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 2,000 parts In-Stock

1+ parts

$1.990

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$1.990

-

-

-

Odintec Ltd.

Israel . 3,094 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,094

-

-

-

-

Digiode

USA . 2,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,227

-

-

-

-

Vyrian

USA . 2,215 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,215

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,216 parts In-Stock

1+ parts

$7.022

100+ parts

-

1k+ parts

$7.575

10k+ parts

-

1,216

$7.022

-

$7.575

-

DigiPath Technology Company

USA . 2,254 parts In-Stock

1+ parts

$7.732

100+ parts

$7.114

1k+ parts

-

10k+ parts

-

2,254

$7.732

$7.114

-

-

ChromeModa Solutions

Germany . 1,924 parts In-Stock

1+ parts

$7.890

100+ parts

$6.470

1k+ parts

-

10k+ parts

-

1,924

$7.890

$6.470

-

-

IDEA Electronic Components Group

UK . 1,555 parts In-Stock

1+ parts

$7.890

100+ parts

-

1k+ parts

$7.101

10k+ parts

-

1,555

$7.890

-

$7.101

-

AZTECH Wire

Italy . 705 parts In-Stock

1+ parts

$13.798

100+ parts

-

1k+ parts

-

10k+ parts

-

705

$13.798

-

-

-

One Stop Electronics

USA . 1,392 parts In-Stock

1+ parts

$178.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,392

$178.000

-

-

-

Corphita

USA . 2,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,563

-

-

-

-

Overview

Elevate your communication systems with the TCM1531P by Texas Instruments, a top-quality Telephone Line IC that offers unmatched reliability and performance. Manufactured by one of the industry leaders, this product is designed to meet the demands of various applications in the telecommunications sector. With its durable plastic/epoxy body and innovative technology, the TCM1531P ensures seamless operation even in challenging environments. Experience the value and benefits of this cutting-edge solution, providing customers with unparalleled efficiency and peace of mind. Choose Texas Instruments for excellence in communication technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, ensuring a long lifespan for the product.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and compatibility with various systems and devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable performance even in warmer environments, making it suitable for a wide range of applications.

Technology: BICMOS

The BICMOS technology used in this product combines the benefits of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Telecom IC Type: TELEPHONE RINGER CIRCUIT

As a telephone ringer circuit, this product is specifically designed to produce clear and audible ringtones for incoming calls, making it an essential component in telephone systems.

Technical Specifications

Telephone Line ICs TCM1531P attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

Length:

9.81 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.0013 mA

Surface Mount:

NO

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM1531P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20