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M3540B

STMicroelectronics

M3540B by STMicroelectronics

STMicroelectronics' M3540B is a Telephone Line IC with 20 terminals in an IN-LINE package. Operating at -10 to 55 °C, it has a supply voltage of 2.5V and current of 1mA. Ideal for commercial applications requiring CMOS technology and Tin/Lead terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,663 parts In-Stock

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8,663

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ComSIT Distribution GmbH

Germany . 4,180 parts In-Stock

1+ parts

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4,180

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Digiode

USA . 1,662 parts In-Stock

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1,662

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Anansix

USA . 370 parts In-Stock

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370

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Corel Iberica Componentes, S.L.

Spain . 38 parts In-Stock

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38

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,207 parts In-Stock

1+ parts

$14.515

100+ parts

-

1k+ parts

$13.063

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2,207

$14.515

-

$13.063

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AZTECH Wire

Italy . 815 parts In-Stock

1+ parts

$18.030

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815

$18.030

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MKK Technologies

India . 131 parts In-Stock

1+ parts

$27.294

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131

$27.294

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DigiPath Technology Company

USA . 131 parts In-Stock

1+ parts

$27.294

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131

$27.294

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Corphita

USA . 4,850 parts In-Stock

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4,850

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Parana Technologies

USA . 989 parts In-Stock

1+ parts

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100+ parts

$17.355

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989

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$17.355

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Assy Fe

Spain . 38 parts In-Stock

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38

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Overview

Upgrade your communication systems with the M3540B by STMicroelectronics. As a leading manufacturer in Telephone Line ICs, STMicroelectronics delivers top-quality products that guarantee reliability and superior performance. The M3540B offers seamless integration, low power consumption, and wide temperature range suitability, making it ideal for various applications. Trust STMicroelectronics to provide innovative solutions that meet your needs and exceed your expectations. Experience the benefits of cutting-edge technology with the M3540B today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the telephone line ICs, ensuring a longer lifespan.

Power Supplies (V): 2.5

The 2.5V power supply allows for efficient power consumption, making the product energy efficient.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the ICs into different types of electronic devices without taking up too much space.

Maximum Operating Temperature: 55 °C

The high maximum operating temperature range ensures the ICs can function reliably even in harsh environmental conditions.

Technology: CMOS

CMOS technology enables low power consumption and high speed operation, making the ICs suitable for various telecommunications applications.

Technical Specifications

Telephone Line ICs M3540B attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2.5

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

1 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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