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MK53731D

STMicroelectronics

MK53731D by STMicroelectronics

STMicroelectronics' MK53731D is a CMOS Telephone Line IC with 20 terminals in a small outline package. Operating at -20 to 60 °C, it requires 3/5V power supply and draws 0.6mA max current. Ideal for telephone line applications with crystal frequency of 3.58MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,670 parts In-Stock

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4,670

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Anansix

USA . 1,862 parts In-Stock

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1,862

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Digiode

USA . 1,416 parts In-Stock

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1,416

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 101 parts In-Stock

1+ parts

$6.839

100+ parts

-

1k+ parts

$6.155

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101

$6.839

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$6.155

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MKK Technologies

India . 496 parts In-Stock

1+ parts

$12.861

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496

$12.861

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DigiPath Technology Company

USA . 496 parts In-Stock

1+ parts

$12.861

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496

$12.861

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Corphita

USA . 2,428 parts In-Stock

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2,428

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Parana Technologies

USA . 1,104 parts In-Stock

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$8.177

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1,104

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$8.177

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Overview

Upgrade your telephone systems with the MK53731D by STMicroelectronics, a top-quality Telephone Line ICs solution that ensures reliable performance. With STMicroelectronics' reputation for excellence in manufacturing, you can trust that this product offers unmatched value and benefits. Ideal for a wide range of applications, this IC provides seamless connectivity and efficiency without compromising on quality. Experience the advantages of the MK53731D and take your communication systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, providing protection for the internal components while keeping the overall product size and weight minimal.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration onto PCBs, saving space and making assembly processes quicker.

Package Shape: RECTANGULAR

The rectangular shape makes it easier to handle and place on circuit boards, ensuring a secure fit and connection.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies gives flexibility in design and compatibility with different systems and applications.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connections and functionality, accommodating various input and output requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, ideal for compact designs and applications where size constraints are important.

Maximum Operating Temperature: 60 °C

With a high maximum operating temperature, this product can withstand demanding environments and ensure reliable performance under elevated temperatures.

Minimum Operating Temperature: -20 °C

The ability to operate at low temperatures makes this product suitable for a wide range of environments and ensures consistent performance in colder conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good conductivity and solderability, making it easier to connect securely to the PCB.

Terminal Position: DUAL

Dual terminal positions offer flexibility in layout and circuit design, allowing for multiple configuration options and easier integration into different systems.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures consistent performance in standard operating conditions, making it suitable for a wide range of commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient operation and reliable signal processing in various applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability, facilitating secure connections and ensuring long-term durability.

Maximum Supply Current: 0.6 mA

The low maximum supply current helps in conserving power and reducing energy consumption, making this product energy-efficient and cost-effective.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and compact arrangement of terminals on the PCB, enabling efficient signal routing and minimizing interference.

Crystal Frequency (MHz): 3.58

The 3.58MHz crystal frequency provides accurate timing and synchronization, essential for proper communication and signal processing in telecommunication applications.

Technical Specifications

Telephone Line ICs MK53731D attributes and parameters. Explore more Telephone Line ICs devices from STMicroelectronics

Specs

Crystal Frequency (MHz):

3.58

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Telephone Circuits

Maximum Supply Current:

.6 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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